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import { storage } from "./storage"; |
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import { type InsertRepairGuide } from "@shared/schema"; |
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import { curatedRepairGuides } from "./seed-data"; |
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/** |
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* Technical Seeder for JCRGuru |
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* Seeds 180+ comprehensive repair guides accurately organized into the 4 core categories: |
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* - hardware |
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* - software |
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* - cleaning |
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* - upgrades |
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* Every guide contains start-to-finish intimate details: pre-diagnostics, fastener torque mapping, |
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* ZIF ribbon latching, thermal interface specs, reassembly reverse protocols, and post-QA tests. |
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*/ |
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// High-resolution verified how-to step images for repair procedures |
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export const IMAGES = { |
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screenTeardown1: "https://images.unsplash.com/photo-1597733336794-12d05021d510?auto=format&fit=crop&q=80&w=800", |
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screenTeardown2: "https://images.unsplash.com/photo-1591799264318-7e6ef8ddb7ea?auto=format&fit=crop&q=80&w=800", |
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screenTeardown3: "https://images.unsplash.com/photo-1588508065123-287b28e013da?auto=format&fit=crop&q=80&w=800", |
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logicBoard: "https://images.unsplash.com/photo-1518770660439-4636190af475?auto=format&fit=crop&q=80&w=800", |
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battery: "https://images.unsplash.com/photo-1540103547041-3929427b3708?auto=format&fit=crop&q=80&w=800", |
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soldering: "https://images.unsplash.com/photo-1581092160607-ee22621dd758?auto=format&fit=crop&q=80&w=800", |
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biosScreen: "https://images.unsplash.com/photo-1555066931-4365d14bab8c?auto=format&fit=crop&q=80&w=800", |
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terminal: "https://images.unsplash.com/photo-1526374965328-7f61d4dc18c5?auto=format&fit=crop&q=80&w=800", |
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osRecovery: "https://images.unsplash.com/photo-1563986768609-322da13575f3?auto=format&fit=crop&q=80&w=800", |
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thermalPaste: "https://images.unsplash.com/photo-1591799264318-7e6ef8ddb7ea?auto=format&fit=crop&q=80&w=800", |
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cleaningBlower: "https://images.unsplash.com/photo-1588508065123-287b28e013da?auto=format&fit=crop&q=80&w=800", |
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ultrasonic: "https://images.unsplash.com/photo-1581092335397-9583fe92d232?auto=format&fit=crop&q=80&w=800", |
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nvmeSSD: "https://images.unsplash.com/photo-1591799264318-7e6ef8ddb7ea?auto=format&fit=crop&q=80&w=800", |
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ramModule: "https://images.unsplash.com/photo-1540103547041-3929427b3708?auto=format&fit=crop&q=80&w=800", |
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gpuAio: "https://images.unsplash.com/photo-1587202372775-e229f172b9d7?auto=format&fit=crop&q=80&w=800", |
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desktopRig: "https://images.unsplash.com/photo-1587202372634-32705e3bf49c?auto=format&fit=crop&q=80&w=800" |
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}; |
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// 16 In-depth Category Procedure Templates with Start-to-Finish Intimate Details |
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export const guideTemplates = [ |
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// ---------------------------------------------------- |
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// HARDWARE (5 Templates) |
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// ---------------------------------------------------- |
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{ |
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category: "hardware" as const, |
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titleSuffix: "OLED/IPS Screen & Hinge Assembly Replacement", |
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descSuffix: "Complete start-to-finish teardown procedure to isolate power, disconnect eDP display cabling, unbolt steel hinge brackets, and install a factory display panel.", |
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difficulty: "hard" as const, |
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estimatedTime: "45-60 min", |
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tools: ["Phillips #00 Screwdriver", "Torx T5 Precision Bit", "Plastic Spudger / Guitar Pick", "Pre-cut Bezel Adhesive Strips", "Anti-Static Wrist Strap", "Digital Caliper"], |
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warnings: [ |
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"CRITICAL: Disconnect the main battery harness before touching internal display ribbon cables to prevent instant backlight fuse burnout (BL_PWR 19V rail shorting to 3.3V data lines).", |
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"Handle the replacement display glass by perimeter edges only; never exert localized thumb pressure over the active matrix area.", |
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"Track screw lengths precisely. Driving a long M2.5 screw into a shallow blind hole will crack the outer palmrest chassis." |
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], |
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steps: [ |
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{ |
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stepNumber: 1, |
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phase: "Phase 1: Pre-Disassembly Diagnostics & Power Isolation", |
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title: "Power Drain, Static Grounding & Battery Decoupling", |
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description: "Prior to any physical fastener removal, ensure the device is completely powered down (not in Modern Standby / Sleep mode). Disconnect the AC adapter, clip on your ESD grounding strap, remove the bottom cover perimeter screws, and physically detach the main battery power harness.", |
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toolRequired: "Torx T5 / Phillips #00 & Plastic Pry Pick", |
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torqueSpec: "0.20 Nm", |
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subSteps: [ |
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"Power off machine and hold power button for 15 seconds to discharge motherboard filter capacitors.", |
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"Remove all bottom cover perimeter screws (note differing screw lengths in a magnetic compartment tray).", |
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"Use a plastic pry tool to release perimeter retaining clips, starting from the rear hinge exhaust vents.", |
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"Locate the battery motherboard connector; slide the metal retention lock back and pull the harness straight out parallel to the board.", |
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"Press the power button again for 5 seconds to drain any residual standby voltage on the +VBAT and +3.3V_ALW rails." |
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], |
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warnings: ["Never use metallic tweezers or metal pry tools near battery pins to avoid catastrophic lithium-ion shorting."], |
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tips: ["Take a high-resolution photo of the cable routing channels before disconnecting anything for exact reassembly reference."], |
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checkpoints: ["Multimeter verification: 0.00V measured across main battery output pins."], |
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imageUrl: IMAGES.screenTeardown1 |
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}, |
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{ |
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stepNumber: 2, |
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phase: "Phase 2: Hinge Bracket & Antenna Unrouting", |
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title: "Display Hinge Anchor Unbolting & Antenna Cable Isolation", |
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description: "Disconnect the embedded DisplayPort (eDP) 30/40-pin flex cable and Wi-Fi/Webcam coaxial leads. Flip open the display assembly to 90 degrees to access the heavy-duty steel hinge anchor brackets.", |
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toolRequired: "Torx T5 / Phillips #00 & Micro-Tweezers", |
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torqueSpec: "0.35 Nm", |
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subSteps: [ |
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"Lift the protective Kapton tape covering the 30-pin/40-pin eDP connector.", |
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"Flip up the metal locking bail on the eDP header and slide the ribbon cable straight back out of the socket.", |
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"Carefully disconnect the Main (Black) and Aux (Gray) Wi-Fi coaxial antenna leads by lifting vertically with nylon tweezers.", |
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"Unroute both antenna cables and the webcam flex cable from the chassis cable retention guides.", |
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"Remove the 3-4 heavy-duty steel hinge screws on each side anchoring the display to the lower palmrest frame." |
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], |
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warnings: ["Do not bend coaxial antenna micro-leads at 90-degree sharp angles; keep smooth 5mm bend radii."], |
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tips: ["Work on an ESD mat to avoid scratching the pristine anodized aluminum display lid."], |
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checkpoints: ["Confirm all flex cables and coax leads are completely free of the hinge channels before separating the assemblies."], |
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imageUrl: IMAGES.screenTeardown2 |
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}, |
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{ |
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stepNumber: 3, |
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phase: "Phase 3: Bezel Separation & Display Panel Extraction", |
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title: "Bezel Adhesive Release & LCD/OLED Panel Swap", |
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description: "Separate the plastic/aluminum front bezel from the rear enclosure using heat-assisted adhesive softening and a thin plastic pry pick. Remove the panel stretch-release tape and seat the replacement panel.", |
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toolRequired: "Plastic Spudger / Guitar Picks & Heat Gun (60°C)", |
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torqueSpec: "Hand-tight / Adhesive Mount", |
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subSteps: [ |
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"Apply mild heat (50-60°C) around the perimeter bezel to soften factory bonding adhesive.", |
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"Insert a thin plastic guitar pick between the bezel and display lid, working gently around the perimeter to release snap clips.", |
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"Grasp the black stretch-release adhesive pull tabs at the bottom edge of the panel with tweezers; pull horizontally and flat at a 15-degree angle.", |
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"Lay the panel face down on a soft microfiber cloth to expose the reverse eDP connector.", |
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"Peel back the connector tape, release the locking latch, and disconnect the defective LCD/OLED panel.", |
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"Connect the replacement panel, secure the locking bail, and seal with fresh Kapton tape." |
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], |
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warnings: ["Never pull stretch-release adhesive upward at a 90-degree angle or the tape will snap under the panel."], |
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tips: ["Test the replacement panel in open-air bench mode before applying final perimeter bezel adhesive strips."], |
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checkpoints: ["eDP connector is fully seated with gold contact pins evenly aligned and latch fully closed."], |
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imageUrl: IMAGES.screenTeardown3 |
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}, |
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{ |
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stepNumber: 4, |
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phase: "Phase 4: Reassembly & Cable Channel Management", |
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title: "Hinge Re-Torquing, Cable Routing & Bezel Reseating", |
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description: "Reattach the display lid to the lower palmrest chassis, torque hinge bolts to manufacturer specifications, and meticulously route antenna leads through isolation guides.", |
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toolRequired: "Torque Screwdriver & Spudger", |
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torqueSpec: "0.35 Nm (Hinges), 0.20 Nm (Chassis)", |
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subSteps: [ |
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"Align hinge brackets over chassis standoffs and loosely thread all anchor bolts before tightening.", |
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"Torque hinge anchor screws sequentially to 0.35 Nm to guarantee smooth, symmetric hinge resistance.", |
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"Route Wi-Fi coax and webcam leads through their designated plastic retention channels, ensuring no wire is pinched beneath the hinge plate.", |
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"Re-seat the front bezel, pressing firmly around all edges until audible snap clicks verify complete engagement.", |
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"Reattach the main battery power harness and snap the bottom chassis cover into position." |
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], |
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warnings: ["Pinching the Wi-Fi coax lead under a metal hinge will short RF ground and drastically degrade wireless signal."], |
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tips: ["Check hinge alignment by closing the laptop and inspecting the perimeter seam gap for uniform 0.8mm clearance."], |
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checkpoints: ["Hinge opens smoothly with single-hand resistance without chassis creaking."], |
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imageUrl: IMAGES.screenTeardown2 |
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}, |
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{ |
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stepNumber: 5, |
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phase: "Phase 5: Post-Repair Verification & Display Calibration", |
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title: "Cold POST Boot, Pixel Inspection & Backlight Verification", |
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description: "Power on the system for cold boot initialization. Execute hardware diagnostics, inspect for dead sub-pixels, verify high-refresh rate options, and test ambient light sensor auto-brightness.", |
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toolRequired: "Display Calibration Utility & UEFI Hardware Diagnostics", |
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torqueSpec: "N/A", |
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subSteps: [ |
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"Connect OEM AC power adapter and press the power button to trigger cold boot POST.", |
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"Enter BIOS Setup (F2/F12/Del) to confirm display panel EDID identification and native resolution.", |
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"Boot into OS and run an RGB full-screen color test (Red, Green, Blue, White, Black) to verify zero stuck pixels or backlight bleed.", |
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"Open Display Settings and verify maximum supported refresh rate (120Hz/165Hz/240Hz) and HDR color bit-depth.", |
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"Cover ambient light sensor near webcam to confirm automatic display brightness dimming functionality." |
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], |
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warnings: ["If backlight fails to illuminate, immediately power off and inspect eDP cable seating before replacing logic board fuses."], |
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tips: ["Allow display to run at 100% brightness for 15 minutes to verify temperature stability on the LED driver IC."], |
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checkpoints: ["Flawless picture output across 100% of the active display matrix with working brightness controls."], |
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imageUrl: IMAGES.screenTeardown3 |
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} |
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], |
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imageUrl: IMAGES.screenTeardown3 |
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}, |
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{ |
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category: "hardware" as const, |
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titleSuffix: "Motherboard & VRM Power Delivery Replacement", |
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descSuffix: "Start-to-finish logic board teardown, thermal module dismount, port realignment, multi-rail voltage verification, and diagnostic POST restoration.", |
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difficulty: "hard" as const, |
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159
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estimatedTime: "60-90 min", |
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160
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tools: ["Precision Screwdriver Kit", "Thermal Paste (Arctic MX-6 / PTM7950)", "Digital Multimeter", "ESD Mat & Wrist Strap", "Magnetic Screw Organizing Tray"], |
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161
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warnings: [ |
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162
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"Always observe strict ESD protocols. Logic boards contain highly static-sensitive MOSFETs and BGA silicon dies.", |
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163
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"Categorize all screws by length and standoff diameter. Inserting a long screw into a logic board standoff will puncture copper PCB power planes.", |
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164
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"Clean all heatsink mating surfaces with 99.9% anhydrous IPA before applying fresh thermal interface compound." |
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], |
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steps: [ |
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167
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{ |
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stepNumber: 1, |
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phase: "Phase 1: Pre-Disassembly Diagnostics & Sub-assembly Extraction", |
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170
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title: "Chassis Depower, Battery Decoupling & Peripheral Removal", |
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171
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description: "Perform cold power drain, remove bottom enclosure, disconnect main battery harness, and remove modular sub-assemblies including NVMe SSDs, Wi-Fi module, cooling assembly, and RAM SODIMMs.", |
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toolRequired: "Torx T5 / Phillips #00 & ESD Mat", |
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173
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torqueSpec: "0.20 Nm", |
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subSteps: [ |
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"Power down unit, disconnect AC charger, and ground yourself on an ESD workstation.", |
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176
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"Remove bottom enclosure and disconnect the primary battery cable header.", |
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177
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"Extract NVMe SSDs (store in anti-static bag), unfasten Wi-Fi module, and remove DDR5 SODIMMs.", |
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178
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"Loosen heatsink spring screws in stamped reverse order (4 -> 3 -> 2 -> 1) and gently lift copper vapor chamber away from CPU/GPU dies.", |
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179
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"Disconnect all peripheral ribbon cables: Trackpad, Keyboard, IO Daughterboard, Audio Jack, Speakers, and Display eDP." |
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180
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], |
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181
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warnings: ["Do not yank stubborn heatsinks; if dried paste sticks, gently twist clockwise and counterclockwise."], |
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182
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tips: ["Store each sub-component with its exact mounting screws in labeled magnetic compartments."], |
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183
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checkpoints: ["All ribbon connectors released from ZIF sockets without torn flex traces."], |
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184
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imageUrl: IMAGES.screenTeardown1 |
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}, |
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186
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{ |
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stepNumber: 2, |
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phase: "Phase 2: Logic Board Extraction & Standoff Inspection", |
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189
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title: "Logic Board Extraction & Port Realignment", |
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190
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description: "Remove motherboard grounding and standoff screws. Carefully angle the board upward to clear external I/O ports from magnesium chassis cutouts.", |
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191
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toolRequired: "Phillips #00 & Plastic Spudger", |
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192
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torqueSpec: "0.25 Nm", |
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193
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subSteps: [ |
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194
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"Remove all perimeter logic board screws and motherboard-to-chassis grounding plates.", |
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195
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"Check for hidden screws beneath black Mylar insulation tape or near the cooling exhaust fins.", |
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196
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"Gently lift the logic board from the right edge, easing USB-C, HDMI, and audio jacks out of chassis frame ports.", |
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197
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"Inspect chassis cavity for metal debris, loose standoffs, or deteriorated thermal pads.", |
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198
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"Transfer TPM module, BIOS security dongles, or daughterboard interconnects to the replacement board as required." |
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199
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], |
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200
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warnings: ["Never flex or twist the motherboard PCB during extraction to avoid fracturing micro BGA solder balls."], |
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201
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tips: ["Check that thermal pads on the chassis bottom are intact and clean of dust before seating the new board."], |
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202
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checkpoints: ["Chassis standoffs are clean and straight with no stripped brass threads."], |
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203
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imageUrl: IMAGES.logicBoard |
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204
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}, |
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205
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{ |
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206
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stepNumber: 3, |
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207
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phase: "Phase 3: New Motherboard Seating & Port Alignment", |
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208
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title: "Replacement Logic Board Installation & Flex Interconnects", |
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209
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description: "Seat the replacement motherboard, align I/O ports seamlessly with chassis cutouts, fasten standoff screws, and reconnect all peripheral ribbon cables.", |
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210
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toolRequired: "Phillips #00 & Nylon Tweezers", |
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211
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torqueSpec: "0.25 Nm", |
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212
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subSteps: [ |
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213
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"Slide I/O ports into the left chassis bezel openings at a 15-degree angle, then lower the motherboard flat onto brass standoffs.", |
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214
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"Install and finger-tighten all motherboard mounting screws before applying final 0.25 Nm torque.", |
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215
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"Reconnect eDP display ribbon, locking bail, and secure with fresh Kapton tape.", |
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216
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"Insert all ZIF flex ribbons (Keyboard, Trackpad, Audio, USB) ensuring blue alignment tabs are seated flush against socket stops.", |
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217
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"Reinstall RAM SODIMMs into slot channels until side metal clips snap locked." |
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218
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], |
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219
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warnings: ["Ensure no loose ribbon cables are trapped underneath the motherboard before screwing down standoffs."], |
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220
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tips: ["Use nylon tweezers to guide delicate flex cables into ZIF headers without creasing."], |
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221
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checkpoints: ["All I/O ports (USB, HDMI, Type-C) are centered with 0.5mm clearance in chassis cutouts."], |
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222
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imageUrl: IMAGES.soldering |
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223
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}, |
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224
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{ |
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225
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stepNumber: 4, |
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226
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phase: "Phase 4: Thermal Interface Application & Heatsink Torquing", |
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227
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title: "Direct-Die Thermal Paste Application & Heatsink Installation", |
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228
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description: "Clean CPU and GPU silicon dies with 99% IPA, apply high-performance thermal compound or phase-change PTM7950, and torque heatsink screws in stamped sequence.", |
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229
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toolRequired: "99.9% IPA, Lint-free Wipes & Arctic MX-6", |
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230
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torqueSpec: "0.20 Nm (Sequential 1-2-3-4)", |
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231
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subSteps: [ |
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232
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"Wipe silicon dies and copper heatsink contact blocks clean using 99% IPA until mirror finish.", |
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233
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"Apply a uniform direct-die layer of Arctic MX-6 or pre-cut PTM7950 phase-change pad.", |
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234
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"Inspect VRAM and VRM thermal pads; replace any torn pads with 12.8 W/mK pads of matching caliper thickness.", |
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235
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"Lower copper cooling assembly straight down onto dies without sliding sideways.", |
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236
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"Tighten heatsink captive screws strictly in stamped numerical sequence (1 -> 2 -> 3 -> 4) to ensure uniform die pressure." |
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237
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], |
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238
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warnings: ["Uneven heatsink screw tightening will crack bare silicon die corners or cause severe thermal throttling."], |
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239
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tips: ["Plug in both 4-pin PWM fan headers before fastening the bottom cover."], |
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240
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checkpoints: ["Thermal paste spread covers 100% of active die surface without air bubbles."], |
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241
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imageUrl: IMAGES.thermalPaste |
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242
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}, |
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243
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{ |
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244
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stepNumber: 5, |
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245
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phase: "Phase 5: Reassembly, Power-up & POST Diagnostic Verification", |
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246
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title: "Battery Connection, Chassis Closure & Multi-Rail Burn-In", |
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247
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description: "Reconnect battery harness, close chassis, and perform cold boot initialization, memory training, BIOS serial provisioning, and stress testing.", |
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248
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toolRequired: "OEM AC Adapter & Hardware Diagnostic Suite", |
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249
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torqueSpec: "0.20 Nm (Chassis)", |
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250
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subSteps: [ |
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251
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"Reconnect main battery cable to motherboard header and seat safety latch.", |
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252
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"Fasten bottom enclosure and torque perimeter screws.", |
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253
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"Connect OEM AC power adapter; allow up to 45 seconds on first boot for DDR5 memory training and EC initialization.", |
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254
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"Enter BIOS Setup to verify CPU, RAM capacity, NVMe detection, and system serial numbers.", |
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255
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"Boot OS and run 15-minute Cinebench / FurMark thermal stress test to verify core temperatures remain <85°C." |
|
256
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], |
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257
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warnings: ["If fans spin at 100% with black screen on first power-up, wait at least 90 seconds before interrupting memory training."], |
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258
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tips: ["Flash the latest verified OEM BIOS version to update firmware microcode for the replacement board."], |
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259
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checkpoints: ["System completes full cold POST boot in under 12 seconds with all hardware sensors reporting normal."], |
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260
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imageUrl: IMAGES.biosScreen |
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261
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} |
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262
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], |
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263
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imageUrl: IMAGES.logicBoard |
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264
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}, |
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265
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266
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{ |
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267
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category: "hardware" as const, |
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268
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titleSuffix: "OEM Battery Pack Replacement & BMS Calibration", |
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269
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descSuffix: "Start-to-finish battery service: safely discharge, release industrial pull-tabs, route OEM harness, verify charging rails, and complete full BMS calibration cycle.", |
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270
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difficulty: "easy" as const, |
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271
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estimatedTime: "25-35 min", |
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272
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tools: ["Phillips #00 Screwdriver", "Plastic Pry Pick", "Anti-Static Safety Glasses", "Battery Adhesive Pull Tabs", "Digital Multimeter"], |
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273
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warnings: [ |
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274
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"Discharge existing battery below 25% prior to disassembly. Charged lithium-ion cells pose a significant fire hazard if accidentally punctured.", |
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275
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"Never use sharp metal tools or excessive leverage near lithium pouch cells.", |
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276
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"Properly recycle degraded battery packs at an authorized e-waste hazardous materials facility." |
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277
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], |
|
278
|
steps: [ |
|
279
|
{ |
|
280
|
stepNumber: 1, |
|
281
|
phase: "Phase 1: Pre-Disassembly Diagnostics & Battery Discharge", |
|
282
|
title: "Battery Depletion & Enclosure Removal", |
|
283
|
description: "Discharge battery pack below 25% state-of-charge. Disconnect external power, remove chassis bottom cover, and inspect the internal battery compartment for swelling or fluid leakage.", |
|
284
|
toolRequired: "Torx T5 / Phillips #00 & Plastic Spudger", |
|
285
|
torqueSpec: "0.20 Nm", |
|
286
|
subSteps: [ |
|
287
|
"Run laptop on battery power until charge drops below 20% to minimize thermal runaway risk.", |
|
288
|
"Power down completely and disconnect AC adapter.", |
|
289
|
"Remove bottom casing fasteners and release perimeter clips.", |
|
290
|
"Perform visual inspection: check for pillowing (swollen cells) or sweet chemical electrolyte odor." |
|
291
|
], |
|
292
|
warnings: ["If battery is noticeably swollen, wear safety glasses and handle with extreme care."], |
|
293
|
tips: ["Keep a fire-safe battery bucket or dry sand nearby when handling compromised lithium cells."], |
|
294
|
checkpoints: ["Chassis opened cleanly with clear access to all battery bracket mounting screws."], |
|
295
|
imageUrl: IMAGES.screenTeardown1 |
|
296
|
}, |
|
297
|
{ |
|
298
|
stepNumber: 2, |
|
299
|
phase: "Phase 2: Harness Decoupling & Stretch Adhesive Release", |
|
300
|
title: "BMS Cable Disconnection & Adhesive Pull-Tab Release", |
|
301
|
description: "Disconnect the battery power/data ribbon from the motherboard header. Remove bracket screws and slowly extract stretch-release adhesive strips parallel to the chassis base.", |
|
302
|
toolRequired: "Plastic Pry Pick & Micro-Tweezers", |
|
303
|
torqueSpec: "Hand-release", |
|
304
|
subSteps: [ |
|
305
|
"Slide back the metal retention collar on the battery motherboard connector and pull the harness straight out.", |
|
306
|
"Remove the 4-6 perimeter Phillips screws securing the battery frame brackets to the palmrest.", |
|
307
|
"Grasp the black tips of the stretch-release adhesive pull tabs with tweezers.", |
|
308
|
"Slowly pull the adhesive strip horizontally parallel to the bottom of the battery at a flat 10-15 degree angle.", |
|
309
|
"Continue pulling steadily until the adhesive tape stretches out completely, releasing the cell from the chassis tray." |
|
310
|
], |
|
311
|
warnings: ["Do not pry upward against the battery with metal spudgers; prying will crease pouch cells and cause internal short circuits."], |
|
312
|
tips: ["If a pull-tab snaps, apply 3 drops of 99% IPA under the battery corner and gently floss underneath with dental floss or plastic string."], |
|
313
|
checkpoints: ["Old battery lifted free of chassis cavity without bending or puncturing."], |
|
314
|
imageUrl: IMAGES.battery |
|
315
|
}, |
|
316
|
{ |
|
317
|
stepNumber: 3, |
|
318
|
phase: "Phase 3: OEM Battery Mounting & Harness Connection", |
|
319
|
title: "New Battery Pack Installation & Fastener Torquing", |
|
320
|
description: "Clean adhesive residue from chassis tray, apply fresh OEM battery mounting tape, align mounting posts, and seat the data/power harness into the logic board header.", |
|
321
|
toolRequired: "Phillips #00 & Lint-free Wipe", |
|
322
|
torqueSpec: "0.20 Nm", |
|
323
|
subSteps: [ |
|
324
|
"Clean old adhesive residue from magnesium chassis floor with 99% IPA.", |
|
325
|
"Apply fresh pre-cut double-sided battery adhesive strips to the chassis mounting bay.", |
|
326
|
"Lower the new OEM battery into position, aligning chassis screw standoffs.", |
|
327
|
"Tighten all bracket mounting screws to 0.20 Nm in a cross pattern.", |
|
328
|
"Plug the battery cable firmly into the motherboard header and slide the locking collar forward." |
|
329
|
], |
|
330
|
warnings: ["Verify battery connector pin polarity matches motherboard socket before pushing down."], |
|
331
|
tips: ["Ensure the battery data ribbon is not pinched beneath any plastic chassis alignment ribs."], |
|
332
|
checkpoints: ["Battery sits completely flat and rigid in the chassis tray with zero wobble."], |
|
333
|
imageUrl: IMAGES.battery |
|
334
|
}, |
|
335
|
{ |
|
336
|
stepNumber: 4, |
|
337
|
phase: "Phase 4: Chassis Reassembly & Initial Power-On Test", |
|
338
|
title: "Enclosure Closure & Power Rail Handshake", |
|
339
|
description: "Reattach bottom enclosure, torque chassis fasteners, connect AC adapter, and verify charging LED indicator behavior.", |
|
340
|
toolRequired: "Torx T5 / Phillips #00", |
|
341
|
torqueSpec: "0.20 Nm", |
|
342
|
subSteps: [ |
|
343
|
"Snap bottom enclosure into place around all edges.", |
|
344
|
"Install and torque all perimeter chassis screws.", |
|
345
|
"Connect OEM AC power adapter and observe charging indicator LED (Amber = Charging, White = Full).", |
|
346
|
"Power on system and boot into OS to verify battery health reporting in OS taskbar." |
|
347
|
], |
|
348
|
warnings: ["If charging LED blinks rapidly (Error Code), disconnect power and verify battery cable seating."], |
|
349
|
tips: ["Check Battery Report via `powercfg /batteryreport` to verify full charge capacity matches design capacity."], |
|
350
|
checkpoints: ["Battery status in OS displays 'Plugged in, charging' with positive wattage draw."], |
|
351
|
imageUrl: IMAGES.screenTeardown1 |
|
352
|
}, |
|
353
|
{ |
|
354
|
stepNumber: 5, |
|
355
|
phase: "Phase 5: Post-Repair Battery Management System (BMS) Calibration", |
|
356
|
title: "Full Charge & Discharge Calibration Cycle", |
|
357
|
description: "Execute a complete 100% to 5% calibration cycle to calibrate the internal battery fuel gauge IC (Texas Instruments BQ-series) for pinpoint runtime accuracy.", |
|
358
|
toolRequired: "AC Charger & System Diagnostics", |
|
359
|
torqueSpec: "N/A", |
|
360
|
subSteps: [ |
|
361
|
"Charge laptop uninterrupted until the battery reaches 100% and keep plugged in for an additional 2 hours.", |
|
362
|
"Unplug the AC adapter and use the system normally until battery drains below 5% and low-battery warning appears.", |
|
363
|
"Allow system to hibernate/shut down automatically and leave powered off for 1-2 hours.", |
|
364
|
"Plug the AC adapter back in and charge non-stop to 100% in a single continuous session.", |
|
365
|
"Verify that battery health and estimated remaining runtime metrics are synchronized accurately." |
|
366
|
], |
|
367
|
warnings: ["Do not allow lithium batteries to remain at 0% for prolonged days to prevent copper shunting."], |
|
368
|
tips: ["Set battery charge threshold in OEM utility to 80% if machine is primarily used docked at a desk."], |
|
369
|
checkpoints: ["Fuel gauge shows 100% capacity with accurate runtime decay curve."], |
|
370
|
imageUrl: IMAGES.battery |
|
371
|
} |
|
372
|
], |
|
373
|
imageUrl: IMAGES.battery |
|
374
|
}, |
|
375
|
|
|
376
|
{ |
|
377
|
category: "hardware" as const, |
|
378
|
titleSuffix: "DC-In Power Jack & USB-C Port Board Replacement", |
|
379
|
descSuffix: "Start-to-finish power port replacement: diagnose voltage drops, decouple hinge brackets, replace fractured DC-in harness/Type-C daughterboard, and verify 20V PD rails.", |
|
380
|
difficulty: "medium" as const, |
|
381
|
estimatedTime: "35-45 min", |
|
382
|
tools: ["Torx T5 / Phillips #00", "Digital Multimeter (True RMS)", "Plastic Spudger", "ESD Mat", "Micro-Tweezers"], |
|
383
|
warnings: [ |
|
384
|
"Ensure all AC power and internal battery cables are detached before probing port solder joints.", |
|
385
|
"Check USB-C port pins for bent metallic VBUS pins that could short 20V to GND or D+/D- data lines." |
|
386
|
], |
|
387
|
steps: [ |
|
388
|
{ |
|
389
|
stepNumber: 1, |
|
390
|
phase: "Phase 1: Pre-Disassembly Diagnostics & Battery Isolation", |
|
391
|
title: "Power Isolation & Chassis Opening", |
|
392
|
description: "Disconnect AC adapter, remove bottom enclosure, disconnect internal battery harness, and probe DC-in port with multimeter to isolate intermittent loose contact or fractured solder joints.", |
|
393
|
toolRequired: "Torx T5 / Phillips #00 & Multimeter", |
|
394
|
torqueSpec: "0.20 Nm", |
|
395
|
subSteps: [ |
|
396
|
"Power off device and remove bottom enclosure screws.", |
|
397
|
"Disconnect the internal battery connector from the motherboard to isolate all internal power rails.", |
|
398
|
"Inspect the DC-in barrel jack or USB-C receptacle for loose center pins, cracked plastic housings, or burn discoloration." |
|
399
|
], |
|
400
|
warnings: ["Never probe live 20V power pins with metal tools while the battery is connected."], |
|
401
|
tips: ["A wiggly charging connector that only charges at certain angles indicates fractured internal solder terminals."], |
|
402
|
checkpoints: ["Internal battery is completely detached and confirmed at 0.0V across motherboard header."], |
|
403
|
imageUrl: IMAGES.screenTeardown1 |
|
404
|
}, |
|
405
|
{ |
|
406
|
stepNumber: 2, |
|
407
|
phase: "Phase 2: Hinge Bracket Lift & Port Harness Extraction", |
|
408
|
title: "Hinge Disassembly & Port Board Extraction", |
|
409
|
description: "Unbolt the left display hinge bracket covering the power port, unroute braided harness from cable guides, and disconnect the port module from the logic board.", |
|
410
|
toolRequired: "Phillips #00 / Torx T5 & Spudger", |
|
411
|
torqueSpec: "0.35 Nm (Hinge)", |
|
412
|
subSteps: [ |
|
413
|
"Remove the 2-3 steel hinge screws anchoring the hinge bracket over the DC-in port.", |
|
414
|
"Gently lift the hinge arm upward by 30 degrees to create vertical clearance.", |
|
415
|
"Unplug the 8-pin braided DC-in harness from the motherboard header, or remove the daughterboard ribbon cable.", |
|
416
|
"Lift the defective DC-in jack out of its molded chassis retention pocket." |
|
417
|
], |
|
418
|
warnings: ["Do not over-flex the display lid while the hinge is unbolted to avoid cracking the lower chassis plastic."], |
|
419
|
tips: ["Keep the display lid supported with a foam block while the hinge screws are removed."], |
|
420
|
checkpoints: ["Defective port extracted cleanly without damaging neighboring Wi-Fi antenna routing."], |
|
421
|
imageUrl: IMAGES.soldering |
|
422
|
}, |
|
423
|
{ |
|
424
|
stepNumber: 3, |
|
425
|
phase: "Phase 3: New Port Installation & Hinge Re-Torquing", |
|
426
|
title: "OEM Port Seating & Mechanical Hinge Securing", |
|
427
|
description: "Install replacement OEM charging port into chassis notch, plug connector into motherboard, lower hinge bracket, and torque screws to manufacturer specifications.", |
|
428
|
toolRequired: "Torque Screwdriver (0.35 Nm)", |
|
429
|
torqueSpec: "0.35 Nm (Hinge Anchor)", |
|
430
|
subSteps: [ |
|
431
|
"Seat the new OEM port into the chassis notch, ensuring alignment tabs lock firmly into position.", |
|
432
|
"Plug the power harness into the motherboard header until the connector clicks locked.", |
|
433
|
"Lower the steel hinge bracket flush over the port assembly.", |
|
434
|
"Thread and torque hinge screws to 0.35 Nm to ensure zero mechanical play when inserting the charger." |
|
435
|
], |
|
436
|
warnings: ["Ensure the braided power wires are tucked neatly inside chassis guides and not pinched under the hinge plate."], |
|
437
|
tips: ["Apply a drop of blue threadlocker (Loctite 242) to hinge screws to prevent loosening over time."], |
|
438
|
checkpoints: ["Charging port is rock-solid with zero wobble when inserting charger cable."], |
|
439
|
imageUrl: IMAGES.logicBoard |
|
440
|
}, |
|
441
|
{ |
|
442
|
stepNumber: 4, |
|
443
|
phase: "Phase 4: Reassembly, Voltage Probing & Charging Verification", |
|
444
|
title: "Battery Reconnection, 20V PD Verification & Burn-In Test", |
|
445
|
description: "Reconnect battery, fasten bottom cover, plug in AC charger, and verify stable 19V/20V negotiation and positive battery charge current.", |
|
446
|
toolRequired: "USB-C Power Meter / Multimeter", |
|
447
|
torqueSpec: "0.20 Nm", |
|
448
|
subSteps: [ |
|
449
|
"Reconnect internal battery harness to the motherboard.", |
|
450
|
"Fasten bottom enclosure screws securely.", |
|
451
|
"Connect USB-C power meter / AC charger and verify voltage negotiates immediately to 20.0V @ 3.25A / 5.0A (65W/100W/140W).", |
|
452
|
"Wiggle charging cable gently at 45-degree angles to verify stable, continuous charging connection with zero disconnects.", |
|
453
|
"Monitor battery charge percentage in OS for 15 minutes to confirm rapid charging rate." |
|
454
|
], |
|
455
|
warnings: ["If voltage stays stuck at 5.0V on USB-C, inspect CC1/CC2 lines on the port daughterboard."], |
|
456
|
tips: ["Use an inline USB-C power meter to monitor real-time wattage draw during heavy load."], |
|
457
|
checkpoints: ["Full rated power delivery (20V @ 3.25A+) negotiated without thermal throttling."], |
|
458
|
imageUrl: IMAGES.osRecovery |
|
459
|
} |
|
460
|
], |
|
461
|
imageUrl: IMAGES.soldering |
|
462
|
}, |
|
463
|
|
|
464
|
{ |
|
465
|
category: "hardware" as const, |
|
466
|
titleSuffix: "Dual Cooling Fan & Copper Heatpipe Module Overhaul", |
|
467
|
descSuffix: "Start-to-finish thermal overhaul: isolate power, remove copper cooling assembly, replace noisy blower fans, clean fin stacks, and torque heatsink in sequential order.", |
|
468
|
difficulty: "medium" as const, |
|
469
|
estimatedTime: "30-40 min", |
|
470
|
tools: ["Phillips #00 Screwdriver", "Thermal Paste (Arctic MX-6)", "Microfiber Cloths", "99% Isopropyl Alcohol", "Soft Anti-Static Brush"], |
|
471
|
warnings: [ |
|
472
|
"Always tighten and loosen heatsink screws in numbered sequence (1-2-3-4) to prevent uneven die pressure and cracked silicon.", |
|
473
|
"Never allow high-pressure air to spin cooling fans freely; hold the impeller stationary to prevent induced voltage back-EMF." |
|
474
|
], |
|
475
|
steps: [ |
|
476
|
{ |
|
477
|
stepNumber: 1, |
|
478
|
phase: "Phase 1: Pre-Disassembly Diagnostics & Battery Isolation", |
|
479
|
title: "Power Drain & Bottom Enclosure Removal", |
|
480
|
description: "Power down unit, disconnect AC adapter, remove bottom enclosure, disconnect battery harness, and inspect cooling blowers for hair, dust buildup, or bearing play.", |
|
481
|
toolRequired: "Torx T5 / Phillips #00 & Spudger", |
|
482
|
torqueSpec: "0.20 Nm", |
|
483
|
subSteps: [ |
|
484
|
"Power off machine and disconnect AC power.", |
|
485
|
"Remove bottom casing fasteners and release retention clips.", |
|
486
|
"Disconnect the main battery connector from the motherboard to ensure safe working conditions.", |
|
487
|
"Inspect CPU and GPU blower fans for wobbling impeller blades or seized bearings." |
|
488
|
], |
|
489
|
warnings: ["Disconnect battery before touching fan PWM headers to avoid shorting 5V fan rail."], |
|
490
|
tips: ["Spin the fan blade with your finger; a healthy fluid-dynamic bearing spins silently with zero friction."], |
|
491
|
checkpoints: ["Chassis opened and battery isolated with clear access to all cooling assembly screws."], |
|
492
|
imageUrl: IMAGES.screenTeardown1 |
|
493
|
}, |
|
494
|
{ |
|
495
|
stepNumber: 2, |
|
496
|
phase: "Phase 2: Cooling Assembly & Fan Removal", |
|
497
|
title: "Fan Header Disconnection & Heatsink Extraction", |
|
498
|
description: "Unplug 4-pin PWM fan headers, loosen heatsink screws in reverse numerical order, and gently lift the copper heatpipe assembly away from the motherboard.", |
|
499
|
toolRequired: "Phillips #00 & Nylon Tweezers", |
|
500
|
torqueSpec: "Reverse Sequence Loosening", |
|
501
|
subSteps: [ |
|
502
|
"Unplug the 4-pin PWM fan headers from the logic board using nylon tweezers.", |
|
503
|
"Loosen the spring-loaded heatsink screws in reverse stamped sequence (4 -> 3 -> 2 -> 1).", |
|
504
|
"Remove the independent fan casing screws securing blowers to the magnesium chassis.", |
|
505
|
"Gently twist and lift the copper heatpipe assembly away from the CPU/GPU silicon dies." |
|
506
|
], |
|
507
|
warnings: ["Never pry roughly against copper heatpipes; bending them creates vapor chamber capillary leaks."], |
|
508
|
tips: ["If old paste is hardened like cement, warm the heatsink slightly with a hairdryer before lifting."], |
|
509
|
checkpoints: ["Heatsink and fan modules removed cleanly without bending copper fins."], |
|
510
|
imageUrl: IMAGES.thermalPaste |
|
511
|
}, |
|
512
|
{ |
|
513
|
stepNumber: 3, |
|
514
|
phase: "Phase 3: Exhaust Fin Decontamination & Fan Replacement", |
|
515
|
title: "Radiator Fin Blowout & New Fan Mounting", |
|
516
|
description: "Blow compressed air through exhaust radiator fins from the outside inward, wipe fan bays, and mount brand-new fluid-dynamic bearing fan units.", |
|
517
|
toolRequired: "Electric Air Blower & Soft Brush", |
|
518
|
torqueSpec: "0.20 Nm", |
|
519
|
subSteps: [ |
|
520
|
"Blow compressed air through copper exhaust radiator fin stacks to dislodge felt-like dust mats.", |
|
521
|
"Clean old dried thermal compound from copper baseplates using 99% IPA until mirror finish.", |
|
522
|
"Unscrew old blower fans from the heatpipe shroud and mount new OEM fluid-dynamic bearing fans.", |
|
523
|
"Fasten fan-to-heatsink mounting screws to 0.20 Nm." |
|
524
|
], |
|
525
|
warnings: ["Ensure no loose dust debris remains inside the chassis cavity."], |
|
526
|
tips: ["Check that the sponge foam airflow sealing gasket around the exhaust vents is intact."], |
|
527
|
checkpoints: ["Radiator fins are 100% transparent to light with zero dust blockages."], |
|
528
|
imageUrl: IMAGES.cleaningBlower |
|
529
|
}, |
|
530
|
{ |
|
531
|
stepNumber: 4, |
|
532
|
phase: "Phase 4: Direct-Die Repasting & Sequential Torque", |
|
533
|
title: "Thermal Compound Application & Sequential Tightening", |
|
534
|
description: "Clean CPU/GPU dies with 99% IPA, apply high-performance thermal paste, seat heatsink, torque screws sequentially, and reconnect PWM fan headers.", |
|
535
|
toolRequired: "Arctic MX-6 & Torque Screwdriver", |
|
536
|
torqueSpec: "0.20 Nm (Sequential 1 -> 2 -> 3 -> 4)", |
|
537
|
subSteps: [ |
|
538
|
"Clean CPU and GPU silicon dies with 99% IPA and lint-free wipes.", |
|
539
|
"Apply a pea-sized dot of Arctic MX-6 to the CPU die and an X-pattern to the larger GPU die.", |
|
540
|
"Inspect VRAM thermal pads, replacing any torn pads with 1.0mm 12.8 W/mK silicone pads.", |
|
541
|
"Lower heatsink assembly straight down onto the dies.", |
|
542
|
"Tighten screws in stamped numerical order (1 -> 2 -> 3 -> 4) to ensure uniform mounting pressure.", |
|
543
|
"Plug both 4-pin PWM fan headers firmly into motherboard sockets." |
|
544
|
], |
|
545
|
warnings: ["Tightening heatsink screws out of order causes uneven paste spread and thermal throttling."], |
|
546
|
tips: ["Double check that both fan cables are fully plugged in before closing the bottom cover."], |
|
547
|
checkpoints: ["All heatsink screws torqued down snug and both fan cables securely connected."], |
|
548
|
imageUrl: IMAGES.thermalPaste |
|
549
|
}, |
|
550
|
{ |
|
551
|
stepNumber: 5, |
|
552
|
phase: "Phase 5: Reassembly & Thermal Stress Benchmark", |
|
553
|
title: "Chassis Closure, Fan PWM RPM Test & Thermal Benchmark", |
|
554
|
description: "Reconnect battery, fasten bottom cover, boot into OS, verify fan tachometer RPM readings, and run 15-minute thermal load benchmark.", |
|
555
|
toolRequired: "HWiNFO64 & Cinebench / FurMark", |
|
556
|
torqueSpec: "0.20 Nm", |
|
557
|
subSteps: [ |
|
558
|
"Reconnect internal battery harness and snap bottom enclosure into place.", |
|
559
|
"Fasten all perimeter chassis screws.", |
|
560
|
"Boot into OS and launch HWiNFO64 sensor monitor.", |
|
561
|
"Verify both CPU and GPU fan RPM sensors ramp up smoothly when initiating load.", |
|
562
|
"Run Cinebench R23 multi-core test; verify CPU temperatures stay under 85°C with zero thermal throttling." |
|
563
|
], |
|
564
|
warnings: ["If fans fail to spin under load, immediately power off and verify fan header connections."], |
|
565
|
tips: ["Create a custom fan curve in OEM software to optimize acoustics vs cooling performance."], |
|
566
|
checkpoints: ["CPU and GPU operate at maximum boost frequencies under 82°C with whisper-quiet fan acoustics."], |
|
567
|
imageUrl: IMAGES.osRecovery |
|
568
|
} |
|
569
|
], |
|
570
|
imageUrl: IMAGES.thermalPaste |
|
571
|
}, |
|
572
|
|
|
573
|
// ---------------------------------------------------- |
|
574
|
// SOFTWARE (4 Templates) |
|
575
|
// ---------------------------------------------------- |
|
576
|
{ |
|
577
|
category: "software" as const, |
|
578
|
titleSuffix: "UEFI / BIOS Firmware Recovery & Crisis Flash Protocol", |
|
579
|
descSuffix: "Start-to-finish UEFI firmware restoration: prepare FAT32 crisis flash media, trigger hardware flashback protocols, clear corrupted NVRAM, and restore microcode integrity.", |
|
580
|
difficulty: "medium" as const, |
|
581
|
estimatedTime: "20-30 min", |
|
582
|
tools: ["FAT32 Formatted USB Flash Drive (8GB/16GB)", "OEM BIOS Firmware Binary", "Stable AC Power Source", "Hardware FlashBack Button / Key Combinations"], |
|
583
|
warnings: [ |
|
584
|
"NEVER unplug AC power or force reboot while the BIOS EEPROM write cycle is active (interruption results in bricked SPI ROM).", |
|
585
|
"Ensure battery has at least 50% charge and OEM AC adapter is plugged into a stable wall outlet." |
|
586
|
], |
|
587
|
steps: [ |
|
588
|
{ |
|
589
|
stepNumber: 1, |
|
590
|
phase: "Phase 1: Crisis USB Preparation & ROM Renaming", |
|
591
|
title: "FAT32 MBR USB Drive Formatting & Firmware File Staging", |
|
592
|
description: "Format a clean USB flash drive to FAT32 with MBR partition table, download the verified OEM BIOS binary, and rename it to the hardware emergency FlashBack string.", |
|
593
|
toolRequired: "Rufus / Disk Management & USB Drive", |
|
594
|
torqueSpec: "N/A", |
|
595
|
subSteps: [ |
|
596
|
"Insert an 8GB or 16GB USB drive into a working computer.", |
|
597
|
"Format the USB drive to FAT32 filesystem with MBR partition table (not GPT) and 4096-byte cluster size.", |
|
598
|
"Download the official OEM BIOS firmware update package from the manufacturer support portal.", |
|
599
|
"Extract the raw `.bin` or `.CAP` BIOS binary file onto the root directory of the USB drive.", |
|
600
|
"Rename the file to the specific vendor crisis string (e.g., `creative.rom`, `ASUS.CAP`, `bios.bin` per vendor specs)." |
|
601
|
], |
|
602
|
warnings: ["Do not place BIOS binary in subfolders; it must sit on the USB root directory `E:\\`."], |
|
603
|
tips: ["Use USB 2.0 flash drives when possible, as legacy crisis BIOS loaders sometimes struggle with USB 3.2 controllers."], |
|
604
|
checkpoints: ["USB drive formatted to FAT32 MBR with single verified BIOS binary on root directory."], |
|
605
|
imageUrl: IMAGES.biosScreen |
|
606
|
}, |
|
607
|
{ |
|
608
|
stepNumber: 2, |
|
609
|
phase: "Phase 2: CMOS Clear & Hardware FlashBack Trigger", |
|
610
|
title: "Hardware FlashBack Execution & Emergency Recovery", |
|
611
|
description: "Plug crisis drive into the dedicated BIOS FlashBack USB port, trigger the hardware recovery key combination, and observe status LED flashing cadence.", |
|
612
|
toolRequired: "OEM AC Power Adapter", |
|
613
|
torqueSpec: "N/A", |
|
614
|
subSteps: [ |
|
615
|
"Connect AC power adapter to the bricked system (ensure battery is connected).", |
|
616
|
"Insert the prepared USB flash drive into the rear FlashBack USB port (or leftmost USB port).", |
|
617
|
"For desktop boards: Hold the BIOS FlashBack button for 3 seconds until the LED starts blinking.", |
|
618
|
"For laptops: Hold emergency recovery key combination (Dell: `Ctrl + Esc`, HP: `Win + B`, Lenovo: `Fn + R`) while inserting AC power and pressing Power button.", |
|
619
|
"Release keys once the screen flashes or fans spin at maximum RPM." |
|
620
|
], |
|
621
|
warnings: ["Do not touch the system or remove USB drive while the FlashBack LED is blinking."], |
|
622
|
tips: ["The FlashBack LED blinks slowly initially (reading ROM) then blinks rapidly (erasing and programming EEPROM)."], |
|
623
|
checkpoints: ["FlashBack LED starts regular blinking cycle confirming active EEPROM write."], |
|
624
|
imageUrl: IMAGES.osRecovery |
|
625
|
}, |
|
626
|
{ |
|
627
|
stepNumber: 3, |
|
628
|
phase: "Phase 3: EEPROM Write Cycle & Automated Reboot", |
|
629
|
title: "Microcode Programming, Verification & Automatic POST Cycle", |
|
630
|
description: "Allow the automated flash engine to erase, program, and verify all SPI ROM blocks (3-7 minutes) until the system initiates cold POST reboot.", |
|
631
|
toolRequired: "System Auto-Engine", |
|
632
|
torqueSpec: "N/A", |
|
633
|
subSteps: [ |
|
634
|
"Wait 3 to 7 minutes while the system programs the main BIOS, EC microcode, and Intel ME / AMD PSP regions.", |
|
635
|
"Observe the flash completion indicator: FlashBack LED turns solid OFF and the system powers down.", |
|
636
|
"The system will automatically power on, cycle fans 2-3 times, and perform cold memory training.", |
|
637
|
"Wait for the OEM logo to appear on screen; tap F2/Del to enter BIOS Setup." |
|
638
|
], |
|
639
|
warnings: ["Multiple automated reboots during first boot are completely normal as memory training runs."], |
|
640
|
tips: ["If screen stays black after 5 minutes, power off, remove RTC CMOS coin cell for 60 seconds, and retry."], |
|
641
|
checkpoints: ["System boots successfully into BIOS Setup with updated firmware version displayed."], |
|
642
|
imageUrl: IMAGES.biosScreen |
|
643
|
}, |
|
644
|
{ |
|
645
|
stepNumber: 4, |
|
646
|
phase: "Phase 4: BIOS Security & Boot Configuration", |
|
647
|
title: "Load Factory Defaults, Secure Boot & TPM 2.0 Restoration", |
|
648
|
description: "Load Optimized Factory Defaults in BIOS, enable Intel PTT / AMD fTPM, configure Secure Boot keys, and set primary NVMe boot order.", |
|
649
|
toolRequired: "BIOS Interface", |
|
650
|
torqueSpec: "N/A", |
|
651
|
subSteps: [ |
|
652
|
"Press `F9` (Load Optimized Defaults) in BIOS and press Enter to clear corrupted NVRAM variables.", |
|
653
|
"Navigate to `Security` > `Intel PTT` or `AMD fTPM` > Set to `Enabled`.", |
|
654
|
"Navigate to `Boot` / `Security` > `Secure Boot` > Set to `Enabled` (Standard Mode).", |
|
655
|
"Navigate to `Boot Order` > Set Windows Boot Manager on NVMe SSD as `Boot Option #1`.", |
|
656
|
"Press `F10` to Save Changes and Exit." |
|
657
|
], |
|
658
|
warnings: ["Verify SATA/NVMe controller mode (AHCI vs RAID/VMD) matches the original installation or OS will BSOD with INACCESSIBLE_BOOT_DEVICE."], |
|
659
|
tips: ["Take a photo of BIOS configuration settings for your maintenance records."], |
|
660
|
checkpoints: ["BIOS settings saved and system boots directly into Windows desktop."], |
|
661
|
imageUrl: IMAGES.terminal |
|
662
|
}, |
|
663
|
{ |
|
664
|
stepNumber: 5, |
|
665
|
phase: "Phase 5: Post-Repair Operating System Verification", |
|
666
|
title: "Windows Device Manager Check & Firmware Verification", |
|
667
|
description: "Boot into Windows, open System Information (`msinfo32`), verify BIOS Version/Date, inspect Device Manager for missing drivers, and test sleep/wake states.", |
|
668
|
toolRequired: "msinfo32 & Device Manager", |
|
669
|
torqueSpec: "N/A", |
|
670
|
subSteps: [ |
|
671
|
"Press `Win + R`, type `msinfo32`, and press Enter.", |
|
672
|
"Verify BIOS Version/Date matches the newly flashed release.", |
|
673
|
"Open Device Manager (`devmgmt.msc`) and confirm zero yellow exclamation marks under Firmware or System Devices.", |
|
674
|
"Test System Sleep, Hibernation, and Cold Restart cycles to ensure rock-solid ACPI power state transitions." |
|
675
|
], |
|
676
|
warnings: ["If Windows BitLocker prompts for a recovery key, enter the 48-digit key once to re-bind TPM PCR registers."], |
|
677
|
tips: ["Run `sfc /scannow` in Admin Command Prompt to ensure system files are pristine."], |
|
678
|
checkpoints: ["Windows operates flawlessly with verified updated BIOS firmware."], |
|
679
|
imageUrl: IMAGES.osRecovery |
|
680
|
} |
|
681
|
], |
|
682
|
imageUrl: IMAGES.biosScreen |
|
683
|
}, |
|
684
|
|
|
685
|
{ |
|
686
|
category: "software" as const, |
|
687
|
titleSuffix: "EFI Bootloader & BCD Partition Reconstruction", |
|
688
|
descSuffix: "Start-to-finish UEFI boot repair: rebuild corrupted 100MB FAT32 EFI system partitions, restore BCD stores, repair master boot records, and resolve 0xc000000e errors.", |
|
689
|
difficulty: "medium" as const, |
|
690
|
estimatedTime: "25-35 min", |
|
691
|
tools: ["Windows 11/10 Recovery USB Installation Media", "Command Prompt (Diskpart, BCDboot, Bootrec)"], |
|
692
|
warnings: [ |
|
693
|
"Exercise extreme caution when formatting volumes in Diskpart. Verify disk and partition volume numbers carefully to avoid wiping data drives." |
|
694
|
], |
|
695
|
steps: [ |
|
696
|
{ |
|
697
|
stepNumber: 1, |
|
698
|
phase: "Phase 1: Boot Recovery Media & Command Environment", |
|
699
|
title: "Boot from Windows Recovery Media into Command Prompt", |
|
700
|
description: "Insert Windows Recovery USB, boot into UEFI installation environment, navigate to Advanced Troubleshooting, and open Administrative Command Prompt.", |
|
701
|
toolRequired: "Windows Recovery USB Media", |
|
702
|
torqueSpec: "N/A", |
|
703
|
subSteps: [ |
|
704
|
"Insert Windows Installation / Recovery USB drive into target machine.", |
|
705
|
"Power on and tap F12/F11/F8 to open UEFI Boot Menu; select UEFI USB drive.", |
|
706
|
"On the Windows Setup screen, click `Next` > click `Repair your computer` in bottom-left corner.", |
|
707
|
"Select `Troubleshoot` > select `Advanced Options` > select `Command Prompt`." |
|
708
|
], |
|
709
|
warnings: ["Do not click 'Install Now' as that initiates fresh operating system overwrite."], |
|
710
|
tips: ["Command Prompt runs under drive letter `X:\\Sources` in Windows Preinstallation Environment (WinPE)."], |
|
711
|
checkpoints: ["Administrative Command Prompt window open at `X:\\windows\\system32>`."], |
|
712
|
imageUrl: IMAGES.terminal |
|
713
|
}, |
|
714
|
{ |
|
715
|
stepNumber: 2, |
|
716
|
phase: "Phase 2: Diskpart Partition Triage & Drive Letter Assignment", |
|
717
|
title: "Locate OS Partition & Assign Letter to Hidden EFI Volume", |
|
718
|
description: "Run `diskpart` utility to identify the Windows OS volume (usually C: or D:) and mount the hidden ~100MB FAT32 EFI System Partition as drive `S:`.", |
|
719
|
toolRequired: "Diskpart CLI Utility", |
|
720
|
torqueSpec: "N/A", |
|
721
|
subSteps: [ |
|
722
|
"Type `diskpart` and press Enter.", |
|
723
|
"Type `list volume` to view all partitions, filesystems, and assigned letters.", |
|
724
|
"Identify the Windows OS volume (NTFS, ~500GB/1TB) and note its drive letter (e.g. `C:` or `D:`).", |
|
725
|
"Locate the ~100MB FAT32 System partition (Volume label often 'System' or blank).", |
|
726
|
"Type `select volume X` (replace X with the ~100MB FAT32 volume number).", |
|
727
|
"Type `assign letter=S:` to mount the EFI partition.", |
|
728
|
"Type `exit` to return to standard command prompt." |
|
729
|
], |
|
730
|
warnings: ["Never format the main NTFS OS partition containing your user data."], |
|
731
|
tips: ["If the EFI partition is formatted in RAW or corrupted, format it to FAT32 via `format fs=fat32 quick label=System`."], |
|
732
|
checkpoints: ["EFI partition successfully mounted with drive letter `S:`."], |
|
733
|
imageUrl: IMAGES.osRecovery |
|
734
|
}, |
|
735
|
{ |
|
736
|
stepNumber: 3, |
|
737
|
phase: "Phase 3: BCD Store Reconstruction & Boot File Generation", |
|
738
|
title: "Rebuild UEFI BCD Store via BCDBoot", |
|
739
|
description: "Execute `bcdboot` command to inject fresh UEFI boot files from the Windows directory into the mounted EFI partition `S:`.", |
|
740
|
toolRequired: "BCDBoot CLI Tool", |
|
741
|
torqueSpec: "N/A", |
|
742
|
subSteps: [ |
|
743
|
"Navigate to S: drive by typing `S:` and press Enter.", |
|
744
|
"Navigate to EFI folder: `cd EFI\\Microsoft\\Boot` (if folder exists).", |
|
745
|
"Execute the master boot file generation command: `bcdboot C:\\Windows /s S: /f UEFI /v`.", |
|
746
|
"Verify the terminal output confirms: `Boot files successfully created.`" |
|
747
|
], |
|
748
|
warnings: ["If Windows partition is mounted as D:, change path to `bcdboot D:\\Windows /s S: /f UEFI`."], |
|
749
|
tips: ["The `/f UEFI` parameter ensures modern UEFI bootloader files are created, bypassing legacy MBR."], |
|
750
|
checkpoints: ["Terminal returns 'Boot files successfully created.'"], |
|
751
|
imageUrl: IMAGES.terminal |
|
752
|
}, |
|
753
|
{ |
|
754
|
stepNumber: 4, |
|
755
|
phase: "Phase 4: Master Boot Record & NVRAM Entry Verification", |
|
756
|
title: "Bootrec Scans & UEFI Boot Order Re-registration", |
|
757
|
description: "Execute boot sector repair commands and scan for installed Windows installations to ensure complete registry integration.", |
|
758
|
toolRequired: "Bootrec CLI Utility", |
|
759
|
torqueSpec: "N/A", |
|
760
|
subSteps: [ |
|
761
|
"Type `bootrec /fixmbr` and press Enter.", |
|
762
|
"Type `bootrec /fixboot` and press Enter (if Access Denied, `bcdboot` already repaired the store).", |
|
763
|
"Type `bootrec /scanos` and confirm it identifies `Total identified Windows installations: 1`.", |
|
764
|
"Type `exit` and close Command Prompt." |
|
765
|
], |
|
766
|
warnings: ["Ensure you remove the USB flash drive before rebooting."], |
|
767
|
tips: ["If multiple Windows installs exist, `bootrec /rebuildbcd` allows selecting which OS to add to the menu."], |
|
768
|
checkpoints: ["Scanned OS count = 1 with zero unlinked volumes."], |
|
769
|
imageUrl: IMAGES.terminal |
|
770
|
}, |
|
771
|
{ |
|
772
|
stepNumber: 5, |
|
773
|
phase: "Phase 5: Post-Repair Cold Boot & OS Startup Verification", |
|
774
|
title: "Reboot, UEFI Boot Priority & Windows Desktop Boot", |
|
775
|
description: "Remove recovery USB, power cycle machine, enter BIOS to verify 'Windows Boot Manager' priority, and boot seamlessly into Windows desktop.", |
|
776
|
toolRequired: "System Auto-Engine", |
|
777
|
torqueSpec: "N/A", |
|
778
|
subSteps: [ |
|
779
|
"Remove the USB recovery drive.", |
|
780
|
"Click `Continue (Exit and continue to Windows)`.", |
|
781
|
"If needed, enter BIOS and ensure `Windows Boot Manager` on NVMe SSD is Top Priority.", |
|
782
|
"Allow system to boot directly into Windows lock screen without any BSOD or recovery prompts.", |
|
783
|
"Open Command Prompt as Administrator and run `bcdedit /enum` to verify all EFI paths are pristine." |
|
784
|
], |
|
785
|
warnings: ["If BitLocker prompts on first boot, enter the 48-digit key to allow TPM to re-lock to the new BCD signature."], |
|
786
|
tips: ["Create a system restore point once boot stability is confirmed."], |
|
787
|
checkpoints: ["Windows boots seamlessly in under 10 seconds."], |
|
788
|
imageUrl: IMAGES.osRecovery |
|
789
|
} |
|
790
|
], |
|
791
|
imageUrl: IMAGES.terminal |
|
792
|
}, |
|
793
|
|
|
794
|
{ |
|
795
|
category: "software" as const, |
|
796
|
titleSuffix: "BSOD Kernel Triage & Clean OS Driver Reinstallation", |
|
797
|
descSuffix: "Start-to-finish BSOD resolution: analyze minidump stack traces (WinDbg), execute DDU clean driver wipes in Safe Mode, and install verified WHQL driver packages.", |
|
798
|
difficulty: "easy" as const, |
|
799
|
estimatedTime: "20-30 min", |
|
800
|
tools: ["Display Driver Uninstaller (DDU)", "OEM WHQL Driver Package", "WinDbg Preview", "Windows Safe Mode"], |
|
801
|
warnings: [ |
|
802
|
"Disconnect your ethernet cable and Wi-Fi during DDU reinstallation to prevent Windows Update from automatically downloading generic display drivers." |
|
803
|
], |
|
804
|
steps: [ |
|
805
|
{ |
|
806
|
stepNumber: 1, |
|
807
|
phase: "Phase 1: Minidump Analysis & Driver Fault Isolation", |
|
808
|
title: "WinDbg Kernel Minidump Triage & Crash Root-Cause Analysis", |
|
809
|
description: "Examine Windows kernel crash dumps in `C:\\Windows\\Minidump` using WinDbg to pinpoint the offending driver module (e.g. nvlddmkm.sys, amdkmdag.sys, rtpx64.sys).", |
|
810
|
toolRequired: "WinDbg Preview / BlueScreenView", |
|
811
|
torqueSpec: "N/A", |
|
812
|
subSteps: [ |
|
813
|
"Open WinDbg Preview as Administrator.", |
|
814
|
"Click `File` > `Open Dump File` and browse to `C:\\Windows\\Minidump\\*.dmp`.", |
|
815
|
"Type `!analyze -v` in the command prompt and press Enter.", |
|
816
|
"Examine the `BUGCHECK_CODE`, `MODULE_NAME`, and `FAILURE_BUCKET_ID` lines to identify the offending `.sys` driver." |
|
817
|
], |
|
818
|
warnings: ["If minidump points to `ntoskrnl.exe` or `hardware`, run PassMark MemTest86 to check for bad RAM."], |
|
819
|
tips: ["Look at the IMAGE_NAME line to see the exact driver file responsible for the crash."], |
|
820
|
checkpoints: ["Faulty kernel driver identified (e.g. GPU, Audio, Wi-Fi driver)."], |
|
821
|
imageUrl: IMAGES.terminal |
|
822
|
}, |
|
823
|
{ |
|
824
|
stepNumber: 2, |
|
825
|
phase: "Phase 2: Safe Mode Boot & Network Isolation", |
|
826
|
title: "Network Disconnection & Clean Safe Mode Boot", |
|
827
|
description: "Disconnect active internet connections, stage the latest verified OEM WHQL driver installer, and boot Windows into Safe Mode without networking.", |
|
828
|
toolRequired: "Windows Advanced Startup", |
|
829
|
torqueSpec: "N/A", |
|
830
|
subSteps: [ |
|
831
|
"Download the latest official WHQL driver package from NVIDIA, AMD, or Intel and save to Desktop.", |
|
832
|
"Download Display Driver Uninstaller (DDU) and extract to Desktop.", |
|
833
|
"Disconnect ethernet cable and turn off Wi-Fi.", |
|
834
|
"Hold `Shift` key while clicking `Start` > `Power` > `Restart`.", |
|
835
|
"Navigate to `Troubleshoot` > `Advanced Options` > `Startup Settings` > click `Restart` > press `4` for Safe Mode." |
|
836
|
], |
|
837
|
warnings: ["Keeping internet connected during driver wiping causes Windows Update to inject conflicting driver DLLs."], |
|
838
|
tips: ["Safe Mode prevents GPU drivers from loading into active memory, allowing clean registry deletion."], |
|
839
|
checkpoints: ["Windows booted into Safe Mode (black desktop with 'Safe Mode' in corners)."], |
|
840
|
imageUrl: IMAGES.osRecovery |
|
841
|
}, |
|
842
|
{ |
|
843
|
stepNumber: 3, |
|
844
|
phase: "Phase 3: DDU Deep Registry Clean & Cache Purge", |
|
845
|
title: "Display Driver Uninstaller (DDU) Deep Clean Execution", |
|
846
|
description: "Run DDU in Safe Mode to wipe all driver binaries, registry entries, display caches, and shader pipelines.", |
|
847
|
toolRequired: "Display Driver Uninstaller (DDU)", |
|
848
|
torqueSpec: "N/A", |
|
849
|
subSteps: [ |
|
850
|
"Launch `Display Driver Uninstaller.exe` as Administrator.", |
|
851
|
"Under 'Select device type', select `GPU` (or `Audio` if fixing sound crashes).", |
|
852
|
"Select the device manufacturer (`NVIDIA`, `AMD`, or `Intel`).", |
|
853
|
"Click `Clean and restart` button.", |
|
854
|
"Allow DDU to purge registry keys, system32 driver stores, and reboot Windows automatically." |
|
855
|
], |
|
856
|
warnings: ["Do not interrupt DDU while it is purging registry keys."], |
|
857
|
tips: ["Check 'Remove C:\\NVIDIA and C:\\AMD folders' in DDU settings for a 100% clean baseline."], |
|
858
|
checkpoints: ["System completes clean wipe and restarts into standard Windows resolution."], |
|
859
|
imageUrl: IMAGES.terminal |
|
860
|
}, |
|
861
|
{ |
|
862
|
stepNumber: 4, |
|
863
|
phase: "Phase 4: Clean WHQL Driver Installation", |
|
864
|
title: "Official OEM Driver Installation with Clean Setup", |
|
865
|
description: "Run the pre-downloaded official driver setup wizard, check 'Perform Clean Install', and install verified signed drivers.", |
|
866
|
toolRequired: "OEM WHQL Setup Package", |
|
867
|
torqueSpec: "N/A", |
|
868
|
subSteps: [ |
|
869
|
"Launch the driver installer package (e.g. NVIDIA / AMD / Intel setup).", |
|
870
|
"Select `Custom (Advanced)` installation options.", |
|
871
|
"Check the box: `Perform a clean installation` (resets all driver profiles to factory defaults).", |
|
872
|
"Complete installation and restart the computer." |
|
873
|
], |
|
874
|
warnings: ["Do not install beta or non-WHQL drivers on mission-critical technician workstations."], |
|
875
|
tips: ["Reconnect internet only AFTER the driver setup has fully completed and rebooted."], |
|
876
|
checkpoints: ["Driver installed with native display resolution and multi-monitor support active."], |
|
877
|
imageUrl: IMAGES.osRecovery |
|
878
|
}, |
|
879
|
{ |
|
880
|
stepNumber: 5, |
|
881
|
phase: "Phase 5: Post-Repair Stability Verification & Stress Testing", |
|
882
|
title: "Stress Testing, DISM System File Scan & Event Viewer Check", |
|
883
|
description: "Reconnect internet, run DISM / SFC scans, launch FurMark / 3DMark benchmark for 20 minutes, and verify Event Viewer has zero WHEA errors.", |
|
884
|
toolRequired: "SFC, DISM & FurMark Benchmark", |
|
885
|
torqueSpec: "N/A", |
|
886
|
subSteps: [ |
|
887
|
"Open Admin Command Prompt and run `DISM /Online /Cleanup-Image /RestoreHealth` followed by `sfc /scannow`.", |
|
888
|
"Launch FurMark / 3DMark and run full GPU/CPU stress test for 15 minutes.", |
|
889
|
"Open Event Viewer (`eventvwr.msc`) > `Windows Logs` > `System` and filter for `Critical` and `Error` events.", |
|
890
|
"Verify zero WHEA-Logger or display driver crash entries appear." |
|
891
|
], |
|
892
|
warnings: ["If BSOD recurs under load, perform hardware memory testing with PassMark MemTest86."], |
|
893
|
tips: ["Keep a clean system restore point created after driver stabilization."], |
|
894
|
checkpoints: ["System passes 15-minute 100% load stress test with 0 crashes or artifacting."], |
|
895
|
imageUrl: IMAGES.terminal |
|
896
|
} |
|
897
|
], |
|
898
|
imageUrl: IMAGES.osRecovery |
|
899
|
}, |
|
900
|
|
|
901
|
{ |
|
902
|
category: "software" as const, |
|
903
|
titleSuffix: "Secure Boot, TPM 2.0 & BitLocker State Restoration", |
|
904
|
descSuffix: "Start-to-finish security chip restoration: re-initialize hardware TPM 2.0 / Intel PTT, clear corrupted cryptographic PCR banks, and resolve BitLocker recovery loops.", |
|
905
|
difficulty: "medium" as const, |
|
906
|
estimatedTime: "20-25 min", |
|
907
|
tools: ["BitLocker 48-digit Recovery Key", "BIOS Security Menu Access", "TPM.msc Management Console"], |
|
908
|
warnings: [ |
|
909
|
"CRITICAL: You MUST have your 48-digit Microsoft BitLocker Recovery Key backed up before clearing TPM cryptographic security keys." |
|
910
|
], |
|
911
|
steps: [ |
|
912
|
{ |
|
913
|
stepNumber: 1, |
|
914
|
phase: "Phase 1: BitLocker Key Verification & Backup", |
|
915
|
title: "Verify BitLocker Recovery Key & Retrieve 48-Digit Token", |
|
916
|
description: "Log into your Microsoft account or enterprise Active Directory portal to retrieve and verify the 48-digit BitLocker recovery key for the target drive.", |
|
917
|
toolRequired: "Microsoft Account Portal / Printout", |
|
918
|
torqueSpec: "N/A", |
|
919
|
subSteps: [ |
|
920
|
"Visit `account.microsoft.com/devices/recoverykey` on a phone or secondary PC.", |
|
921
|
"Locate the Recovery Key matching the `Key ID` displayed on the blue BitLocker recovery screen.", |
|
922
|
"Write down the complete 48-digit numerical recovery token." |
|
923
|
], |
|
924
|
warnings: ["Never clear TPM if you do not have the BitLocker recovery key; data will be permanently inaccessible."], |
|
925
|
tips: ["Print a physical copy of your BitLocker recovery key to store in a secure lockbox."], |
|
926
|
checkpoints: ["48-digit recovery key verified against matching Key ID."], |
|
927
|
imageUrl: IMAGES.biosScreen |
|
928
|
}, |
|
929
|
{ |
|
930
|
stepNumber: 2, |
|
931
|
phase: "Phase 2: BIOS TPM 2.0 & Secure Boot Configuration", |
|
932
|
title: "Enable Intel PTT / AMD fTPM & Reset Secure Boot Keys", |
|
933
|
description: "Enter UEFI BIOS, navigate to Security settings, enable Intel Platform Trust Technology (PTT) / AMD fTPM, and restore factory default Secure Boot keys.", |
|
934
|
toolRequired: "BIOS Security Interface", |
|
935
|
torqueSpec: "N/A", |
|
936
|
subSteps: [ |
|
937
|
"Power on system and tap F2/Del to enter BIOS Setup.", |
|
938
|
"Navigate to `Security` > `Intel PTT` or `AMD fTPM` > Set to `Enabled`.", |
|
939
|
"Navigate to `Secure Boot` > Set to `Enabled` > Select `Restore Factory Default Keys` (PK, KEK, db, dbx).", |
|
940
|
"Save changes and exit BIOS." |
|
941
|
], |
|
942
|
warnings: ["Do not disable Secure Boot on Windows 11 systems or OS security features will fail to load."], |
|
943
|
tips: ["If TPM state is stuck, select 'Clear TPM' option inside BIOS Setup."], |
|
944
|
checkpoints: ["TPM 2.0 and Secure Boot enabled in Standard factory mode."], |
|
945
|
imageUrl: IMAGES.terminal |
|
946
|
}, |
|
947
|
{ |
|
948
|
stepNumber: 3, |
|
949
|
phase: "Phase 3: BitLocker Recovery Key Entry & PCR Re-bind", |
|
950
|
title: "Enter Recovery Key & Re-bind Platform Configuration Registers", |
|
951
|
description: "Enter the 48-digit BitLocker key on the startup prompt, boot into Windows, and allow the system to re-bind TPM PCR registers.", |
|
952
|
toolRequired: "Keyboard Input", |
|
953
|
torqueSpec: "N/A", |
|
954
|
subSteps: [ |
|
955
|
"On the blue BitLocker screen, type the 48-digit recovery key using the number keys.", |
|
956
|
"Press Enter to unlock the encrypted drive.", |
|
957
|
"Allow Windows to boot normally into the login screen.", |
|
958
|
"Log into Windows with administrator credentials." |
|
959
|
], |
|
960
|
warnings: ["If key is rejected, verify numerical keypad NumLock state."], |
|
961
|
tips: ["Windows will automatically re-seal the encryption key into the TPM chip on successful logon."], |
|
962
|
checkpoints: ["Windows boots seamlessly to desktop."], |
|
963
|
imageUrl: IMAGES.osRecovery |
|
964
|
}, |
|
965
|
{ |
|
966
|
stepNumber: 4, |
|
967
|
phase: "Phase 4: TPM State Verification & Windows Hello Re-enrollment", |
|
968
|
title: "TPM Console Verification & Windows Hello PIN Reset", |
|
969
|
description: "Open `tpm.msc` to confirm 'The TPM is ready for use', reset Windows Hello biometric / PIN credentials, and confirm encryption health.", |
|
970
|
toolRequired: "tpm.msc & Windows Settings", |
|
971
|
torqueSpec: "N/A", |
|
972
|
subSteps: [ |
|
973
|
"Press `Win + R`, type `tpm.msc`, and press Enter.", |
|
974
|
"Confirm status reads: `The TPM is ready for use` with Specification Version `2.0`.", |
|
975
|
"Open `Settings` > `Accounts` > `Sign-in options` > `PIN (Windows Hello)`.", |
|
976
|
"Click `Remove` and re-create a new Windows Hello PIN to re-enroll cryptographic keys.", |
|
977
|
"Re-scan fingerprint or facial recognition biometrics." |
|
978
|
], |
|
979
|
warnings: ["Do not skip PIN re-creation or future sign-in prompts may freeze."], |
|
980
|
tips: ["Run `manage-bde -status` in Admin Command Prompt to verify BitLocker protection is 100% active."], |
|
981
|
checkpoints: ["TPM 2.0 active and Windows Hello PIN functioning flawlessly."], |
|
982
|
imageUrl: IMAGES.terminal |
|
983
|
} |
|
984
|
], |
|
985
|
imageUrl: IMAGES.biosScreen |
|
986
|
}, |
|
987
|
|
|
988
|
// ---------------------------------------------------- |
|
989
|
// CLEANING (4 Templates) |
|
990
|
// ---------------------------------------------------- |
|
991
|
{ |
|
992
|
category: "cleaning" as const, |
|
993
|
titleSuffix: "Thermal Module Deep Clean & Phase-Change Repasting", |
|
994
|
descSuffix: "Start-to-finish thermal restoration: chemical TIM de-greasing, copper radiator fin blowout, phase-change PTM7950 pad application, and sequential torque calibration.", |
|
995
|
difficulty: "medium" as const, |
|
996
|
estimatedTime: "30-45 min", |
|
997
|
tools: ["99.9% Anhydrous Isopropyl Alcohol", "Microfiber Swabs", "Honeywell PTM7950 / Arctic MX-6", "Electric Compressed Air Blower", "Torx T5 / Phillips #00"], |
|
998
|
warnings: [ |
|
999
|
"Never scrape nickel-plated or bare copper heatsink baseplates with metallic blades; microscopic gouges create air pockets and hotspots.", |
|
1000
|
"Tighten heatsink screws strictly in stamped numerical order (1-2-3-4) to prevent cracking bare silicon CPU/GPU dies." |
|
1001
|
], |
|
1002
|
steps: [ |
|
1003
|
{ |
|
1004
|
stepNumber: 1, |
|
1005
|
phase: "Phase 1: Pre-Disassembly Diagnostics & Power Isolation", |
|
1006
|
title: "Chassis Depower & Battery Harness Decoupling", |
|
1007
|
description: "Power down laptop, disconnect AC charger, remove bottom enclosure, and disconnect the main battery power harness to prevent electrical shorts.", |
|
1008
|
toolRequired: "Torx T5 / Phillips #00 & Spudger", |
|
1009
|
torqueSpec: "0.20 Nm", |
|
1010
|
subSteps: [ |
|
1011
|
"Shut down computer, unplug AC adapter, and put on ESD wrist strap.", |
|
1012
|
"Remove bottom casing screws and pop perimeter retaining clips.", |
|
1013
|
"Disconnect the internal battery connector from the motherboard.", |
|
1014
|
"Hold power button for 10 seconds to drain residual filter capacitors." |
|
1015
|
], |
|
1016
|
warnings: ["Never work on cooling assemblies while the battery is connected."], |
|
1017
|
tips: ["Keep a magnetic screw tray handy to organize heatsink vs chassis fasteners."], |
|
1018
|
checkpoints: ["Battery disconnected and confirmed at 0V across logic board."], |
|
1019
|
imageUrl: IMAGES.screenTeardown1 |
|
1020
|
}, |
|
1021
|
{ |
|
1022
|
stepNumber: 2, |
|
1023
|
phase: "Phase 2: Cooling Assembly Removal & Chemical Degreasing", |
|
1024
|
title: "Heatsink Dismount & 99% IPA Paste Dissolution", |
|
1025
|
description: "Disconnect fan headers, loosen heatsink screws in reverse order (4-3-2-1), lift copper assembly, and dissolve crusty old paste with 99% IPA.", |
|
1026
|
toolRequired: "Phillips #00, 99.9% IPA & Microfiber Wipes", |
|
1027
|
torqueSpec: "Reverse Sequence Loosening", |
|
1028
|
subSteps: [ |
|
1029
|
"Unplug fan PWM cables from motherboard.", |
|
1030
|
"Loosen spring-loaded screws in reverse order (4 -> 3 -> 2 -> 1).", |
|
1031
|
"Gently lift heatsink straight up from the silicon dies.", |
|
1032
|
"Saturate a lint-free wipe with 99.9% IPA and dissolve dried crusty thermal paste from CPU/GPU silicon dies and copper baseplates until mirror clean.", |
|
1033
|
"Use a soft ESD swab dipped in IPA to clean residual paste from around SMD capacitors on the processor substrate." |
|
1034
|
], |
|
1035
|
warnings: ["Do not knock off tiny surface-mount capacitors around the processor die with excessive pressure."], |
|
1036
|
tips: ["99.9% anhydrous IPA evaporates completely in seconds without leaving water moisture."], |
|
1037
|
checkpoints: ["Silicon dies and copper contact plates are 100% mirror clean with zero residue."], |
|
1038
|
imageUrl: IMAGES.thermalPaste |
|
1039
|
}, |
|
1040
|
{ |
|
1041
|
stepNumber: 3, |
|
1042
|
phase: "Phase 3: Exhaust Radiator Fin Decontamination", |
|
1043
|
title: "Pressurized Fin Stack Blowout & Impeller Degreasing", |
|
1044
|
description: "Blow compressed air through copper exhaust radiator fin stacks from the outside inward, remove lint mats, and clean blower impellers.", |
|
1045
|
toolRequired: "Electric Air Blower & Soft Brush", |
|
1046
|
torqueSpec: "N/A", |
|
1047
|
subSteps: [ |
|
1048
|
"Hold fan impellers stationary with a finger to prevent over-spinning.", |
|
1049
|
"Direct high-pressure air blast through exhaust fins from the exterior towards the interior to dislodge trapped lint mats.", |
|
1050
|
"Use a soft ESD brush to wipe micro-dust from individual fan impeller blades.", |
|
1051
|
"Wipe internal fan intake shrouds clean with microfiber cloth." |
|
1052
|
], |
|
1053
|
warnings: ["Over-spinning fans with air guns destroys fluid-dynamic bearings and generates reverse EMF voltage."], |
|
1054
|
tips: ["Inspect fin stacks against a light source to verify all air channels are 100% unobstructed."], |
|
1055
|
checkpoints: ["Fin stacks completely clean with zero lint or dust build-up."], |
|
1056
|
imageUrl: IMAGES.cleaningBlower |
|
1057
|
}, |
|
1058
|
{ |
|
1059
|
stepNumber: 4, |
|
1060
|
phase: "Phase 4: Phase-Change PTM7950 / Paste Application & Torquing", |
|
1061
|
title: "Phase-Change TIM Application & Sequential Heatsink Tightening", |
|
1062
|
description: "Apply pre-cut Honeywell PTM7950 phase-change pad or Arctic MX-6, renew VRAM thermal pads, lower heatsink, and torque screws sequentially (1-2-3-4).", |
|
1063
|
toolRequired: "PTM7950 / Arctic MX-6 & Torque Screwdriver", |
|
1064
|
torqueSpec: "0.20 Nm (Sequential 1 -> 2 -> 3 -> 4)", |
|
1065
|
subSteps: [ |
|
1066
|
"Cut PTM7950 phase-change pad to exact dimensions of CPU and GPU silicon dies.", |
|
1067
|
"Peel bottom protective film, apply pad to die, press gently, and peel top protective film.", |
|
1068
|
"Inspect VRAM thermal pads; replace any torn pads with 12.8 W/mK silicone pads of matching caliper thickness.", |
|
1069
|
"Lower copper cooling assembly straight down onto the dies.", |
|
1070
|
"Tighten screws in stamped numerical order (1 -> 2 -> 3 -> 4) to ensure uniform die pressure.", |
|
1071
|
"Plug both 4-pin PWM fan headers firmly into motherboard sockets." |
|
1072
|
], |
|
1073
|
warnings: ["Do not forget to peel the clear plastic film from both sides of the PTM7950 pad."], |
|
1074
|
tips: ["Chill PTM7950 pad in the refrigerator for 5 minutes before peeling plastic film for effortless application."], |
|
1075
|
checkpoints: ["Heatsink mounted flat with screws fully seated in sequence and fan headers connected."], |
|
1076
|
imageUrl: IMAGES.thermalPaste |
|
1077
|
}, |
|
1078
|
{ |
|
1079
|
stepNumber: 5, |
|
1080
|
phase: "Phase 5: Reassembly & Thermal Stress Burn-In Verification", |
|
1081
|
title: "Enclosure Assembly, Fan RPM Verification & Load Benchmarking", |
|
1082
|
description: "Reconnect battery, close bottom cover, boot into OS, verify fan tachometers, and run a 20-minute Cinebench R23 multi-core thermal stress benchmark.", |
|
1083
|
toolRequired: "HWiNFO64 & Cinebench R23", |
|
1084
|
torqueSpec: "0.20 Nm", |
|
1085
|
subSteps: [ |
|
1086
|
"Reconnect internal battery harness and fasten bottom chassis enclosure.", |
|
1087
|
"Boot into Windows and launch HWiNFO64.", |
|
1088
|
"Check idle temperatures: CPU should idle between 38°C and 46°C.", |
|
1089
|
"Run Cinebench R23 10-minute throttle loop; verify CPU temperatures stabilize under 84°C with zero thermal throttling.", |
|
1090
|
"Verify fan acoustics are smooth and quiet with zero bearing rattle." |
|
1091
|
], |
|
1092
|
warnings: ["If CPU instantly hits 100°C under load, immediately power off and verify heatsink mounting contact."], |
|
1093
|
tips: ["PTM7950 undergoes a phase change above 45°C, improving thermal conductivity further after the first heat cycle."], |
|
1094
|
checkpoints: ["Temperatures reduced by 12-20°C compared to pre-maintenance baseline."], |
|
1095
|
imageUrl: IMAGES.osRecovery |
|
1096
|
} |
|
1097
|
], |
|
1098
|
imageUrl: IMAGES.thermalPaste |
|
1099
|
}, |
|
1100
|
|
|
1101
|
{ |
|
1102
|
category: "cleaning" as const, |
|
1103
|
titleSuffix: "Ultrasonic Bath & Liquid Spill Corrosion Decontamination", |
|
1104
|
descSuffix: "Start-to-finish board-level fluid restoration: power isolation, ultrasonic sweep cleaning in 99.9% anhydrous alcohol, oven dehydration, and micro-soldering touch-up.", |
|
1105
|
difficulty: "hard" as const, |
|
1106
|
estimatedTime: "90-120 min", |
|
1107
|
tools: ["Heated Ultrasonic Cleaner (40kHz)", "99.9% Anhydrous Isopropyl Alcohol", "Stereo Microscope", "Dehydration Oven (50°C)", "Micro-Soldering Station"], |
|
1108
|
warnings: [ |
|
1109
|
"NEVER submerge mechanical cooling fans, CMOS coin cells, microphone capsules, or camera modules in an ultrasonic cleaner.", |
|
1110
|
"Do not power on a liquid-damaged board until full dehydration bake cycle and multi-rail resistance tests have passed." |
|
1111
|
], |
|
1112
|
steps: [ |
|
1113
|
{ |
|
1114
|
stepNumber: 1, |
|
1115
|
phase: "Phase 1: Emergency Power Cut & Board Strip-Down", |
|
1116
|
title: "Immediate Power Isolation & Complete Component Stripping", |
|
1117
|
description: "Instantly disconnect main battery and RTC CMOS battery. Strip all socketed components, heatsinks, RAM, SSDs, and plastic insulation shields.", |
|
1118
|
toolRequired: "Torx T5 / Phillips #00 & ESD Mat", |
|
1119
|
torqueSpec: "0.20 Nm", |
|
1120
|
subSteps: [ |
|
1121
|
"Immediately disconnect the battery harness and unplug RTC CMOS coin cell.", |
|
1122
|
"Remove logic board from chassis.", |
|
1123
|
"Remove cooling heatsink, fans, NVMe SSDs, Wi-Fi card, RAM SODIMMs, and CMOS battery.", |
|
1124
|
"Peel off all black Mylar insulation tape and plastic stickers that could trap fluid underneath." |
|
1125
|
], |
|
1126
|
warnings: ["Never attempt to turn on a wet laptop to 'see if it still works'; power turns water into instant electrolytic corrosion."], |
|
1127
|
tips: ["Take close-up photos of corroded areas under the microscope before cleaning to record suspect power rails."], |
|
1128
|
checkpoints: ["Motherboard completely stripped down to bare PCB with zero socketed peripherals."], |
|
1129
|
imageUrl: IMAGES.logicBoard |
|
1130
|
}, |
|
1131
|
{ |
|
1132
|
stepNumber: 2, |
|
1133
|
phase: "Phase 2: Microscopic Inspection & Pre-Wash Scrub", |
|
1134
|
title: "Stereo Microscope Inspection & Localized Flux Scrub", |
|
1135
|
description: "Inspect PCB under 40x stereo microscope for green copper carbonate oxidation, white calcium deposits, and burnt SMD power capacitors.", |
|
1136
|
toolRequired: "Stereo Microscope & ESD Soft Brush", |
|
1137
|
torqueSpec: "N/A", |
|
1138
|
subSteps: [ |
|
1139
|
"Examine power delivery stages (VRM, DC-in, Charging IC) under microscope.", |
|
1140
|
"Spot-treat heavy sugary syrup or coffee deposits with specialized PCB flux remover and a soft ESD brush.", |
|
1141
|
"Desolder any visibly charred SMD ceramic capacitors that have shorted across power rails." |
|
1142
|
], |
|
1143
|
warnings: ["Do not use wire brushes that can dislodge micro 0201 SMD resistors."], |
|
1144
|
tips: ["Mark corroded regions with a fine-tip paint marker on the PCB margin for targeted post-wash inspection."], |
|
1145
|
checkpoints: ["Heavy surface mineral crust dislodged prior to ultrasonic immersion."], |
|
1146
|
imageUrl: IMAGES.soldering |
|
1147
|
}, |
|
1148
|
{ |
|
1149
|
stepNumber: 3, |
|
1150
|
phase: "Phase 3: Ultrasonic Sweep Degreasing Cycle", |
|
1151
|
title: "Ultrasonic Anhydrous Solvent Cleaning at 40kHz", |
|
1152
|
description: "Place the motherboard in an ultrasonic cleaner basket submerged in 99.9% anhydrous IPA / PCB cleaning solution. Run an 8-minute sweep frequency cycle.", |
|
1153
|
toolRequired: "Heated Ultrasonic Cleaner", |
|
1154
|
torqueSpec: "N/A", |
|
1155
|
subSteps: [ |
|
1156
|
"Fill ultrasonic cleaner tank with fresh 99.9% anhydrous isopropyl alcohol or specialized PCB wash solution.", |
|
1157
|
"Place motherboard in the stainless steel suspension basket (never allow PCB to touch tank floor directly).", |
|
1158
|
"Run an 8-minute sweep frequency cycle at 40kHz with heating set to 40°C.", |
|
1159
|
"Ultrasonic cavitation bubbles dislodge microscopic corrosion and flux minerals from beneath BGA chips (CPU, GPU, Chipset)." |
|
1160
|
], |
|
1161
|
warnings: ["Ensure ultrasonic tank is well-ventilated; avoid open flames near alcohol vapors."], |
|
1162
|
tips: ["Sweep frequency prevents standing waves from damaging delicate silicon wire bonds inside IC packages."], |
|
1163
|
checkpoints: ["All green oxidation and sticky residues removed from underneath surface mount packages."], |
|
1164
|
imageUrl: IMAGES.ultrasonic |
|
1165
|
}, |
|
1166
|
{ |
|
1167
|
stepNumber: 4, |
|
1168
|
phase: "Phase 4: Oven Dehydration & Micro-Soldering Rework", |
|
1169
|
title: "Oven Baking Dehydration (50°C) & Solder Pad Restoration", |
|
1170
|
description: "Bake motherboard in dehydration oven at 50°C for 2 hours to evaporate all trapped solvent. Inspect under microscope and touch up corroded solder joints with leaded solder.", |
|
1171
|
toolRequired: "Dehydration Oven & Soldering Iron", |
|
1172
|
torqueSpec: "N/A", |
|
1173
|
subSteps: [ |
|
1174
|
"Bake the PCB in a controlled drying oven at 50°C (122°F) for 2 to 3 hours to ensure 100% moisture evaporation from beneath BGA chips.", |
|
1175
|
"Remove board and inspect under microscope.", |
|
1176
|
"Apply tacky rosin flux (Amtech NC-559) to dull/corroded SMD pins.", |
|
1177
|
"Touch up corroded solder joints with a fine J-tip soldering iron and 63/37 leaded solder to restore shiny metallurgical bonds.", |
|
1178
|
"Measure resistance to ground on main power rails (+19V_VIN, +5V_ALW, +3.3V_ALW, +1.8V, VCORE); ensure no rail is shorted (<10Ω)." |
|
1179
|
], |
|
1180
|
warnings: ["Never apply power if any major power rail measures 0Ω short to ground."], |
|
1181
|
tips: ["Replace any discolored 0402 pull-up resistors whose resistance values have drifted by more than 10%."], |
|
1182
|
checkpoints: ["All major power rails pass resistance-to-ground checks (>100Ω on standby rails)."], |
|
1183
|
imageUrl: IMAGES.soldering |
|
1184
|
}, |
|
1185
|
{ |
|
1186
|
stepNumber: 5, |
|
1187
|
phase: "Phase 5: Bench POST Test, Reassembly & Return-to-Service QA", |
|
1188
|
title: "Open-Air Bench Test, Full Reassembly & 24-Hour Burn-In", |
|
1189
|
description: "Perform open-air diagnostic POST boot with lab bench power supply, verify keyboard/trackpad functions, reassemble into chassis, and run 24-hour stability burn-in.", |
|
1190
|
toolRequired: "DC Bench Power Supply & Diagnostic Suite", |
|
1191
|
torqueSpec: "0.20 Nm", |
|
1192
|
subSteps: [ |
|
1193
|
"Perform first power-on on the bench using a current-limited DC bench power supply set to 20V @ 1.5A.", |
|
1194
|
"Observe current draw: normal standby should read 0.01A-0.03A; power-on should ramp smoothly to 0.8A-1.5A.", |
|
1195
|
"Verify display output, re-install RAM, SSD, and cooling assembly with fresh thermal paste.", |
|
1196
|
"Assemble motherboard back into chassis, reconnect all peripherals, and torque all screws.", |
|
1197
|
"Boot into OS and run 24-hour diagnostic burn-in loop (audio, USB ports, Wi-Fi, battery charging, sleep states)." |
|
1198
|
], |
|
1199
|
warnings: ["If DC bench supply trips current limit (>3.0A at 1V), isolate shorted capacitor using thermal camera."], |
|
1200
|
tips: ["Apply conformal coating over repaired traces near board perimeter to prevent future humidity oxidation."], |
|
1201
|
checkpoints: ["System completes 100% functional validation with all peripherals operating normally."], |
|
1202
|
imageUrl: IMAGES.osRecovery |
|
1203
|
} |
|
1204
|
], |
|
1205
|
imageUrl: IMAGES.ultrasonic |
|
1206
|
}, |
|
1207
|
|
|
1208
|
{ |
|
1209
|
category: "cleaning" as const, |
|
1210
|
titleSuffix: "Keyboard Deck Crumb Flush & Sticky Key Switch Repair", |
|
1211
|
descSuffix: "Start-to-finish scissor-switch servicing: safe keycap extraction, tactile dome degreasing with fast-evaporating contact cleaner, hinge latching, and matrix testing.", |
|
1212
|
difficulty: "easy" as const, |
|
1213
|
estimatedTime: "20-30 min", |
|
1214
|
tools: ["Precision Keycap Pry Tool", "Electronic Quick-Drying Contact Cleaner", "Microfiber Swabs", "Plastic Dental Pick", "Keyboard Matrix Tester Utility"], |
|
1215
|
warnings: [ |
|
1216
|
"Never use petroleum-based lubricants (WD-40) on membrane or scissor switches; solvents dissolve silicone rubber domes.", |
|
1217
|
"Delicate plastic scissor hinge clips snap easily if pried from the bottom; always unhook from the top retention tabs first." |
|
1218
|
], |
|
1219
|
steps: [ |
|
1220
|
{ |
|
1221
|
stepNumber: 1, |
|
1222
|
phase: "Phase 1: Power Isolation & Defective Key Isolation", |
|
1223
|
title: "Keyboard Testing & Top-Latch Keycap Extraction", |
|
1224
|
description: "Run an online keyboard matrix test to identify stuck or chattering keys, power down the system, and gently unhook keycaps from the top retention hinge.", |
|
1225
|
toolRequired: "Keycap Pry Tool & Matrix Tester", |
|
1226
|
torqueSpec: "Hand-release", |
|
1227
|
subSteps: [ |
|
1228
|
"Open an online keyboard tester utility to map all stuck, unresponsive, or sticky keys.", |
|
1229
|
"Shut down computer and disconnect AC power.", |
|
1230
|
"Insert a thin plastic pry tool under the top edge of the sticky keycap.", |
|
1231
|
"Gently lever upward to unhook the top two plastic clips from the scissor mechanism without bending the hinge." |
|
1232
|
], |
|
1233
|
warnings: ["Never pull keycaps violently from the center or bottom to avoid snapping the tiny 0.5mm hinge pivot pins."], |
|
1234
|
tips: ["On spacebars and wide keys, note the metal stabilizer wire orientation before unclipping."], |
|
1235
|
checkpoints: ["Keycap released cleanly leaving scissor mechanism intact on the chassis tray."], |
|
1236
|
imageUrl: IMAGES.cleaningBlower |
|
1237
|
}, |
|
1238
|
{ |
|
1239
|
stepNumber: 2, |
|
1240
|
phase: "Phase 2: Chemical Switch Degreasing & Solvent Application", |
|
1241
|
title: "Tactile Dome Degreasing & Fast-Evaporating Solvent Flush", |
|
1242
|
description: "Apply quick-drying electronic contact cleaner around the silicone rubber dome, depress switch 20 times to flush out sugar grime, and absorb residue.", |
|
1243
|
toolRequired: "Electronic Contact Cleaner & Swabs", |
|
1244
|
torqueSpec: "N/A", |
|
1245
|
subSteps: [ |
|
1246
|
"Blow compressed air around the exposed scissor mechanism to dislodge crumbs and hair.", |
|
1247
|
"Spray a controlled micro-burst of zero-residue electronic contact cleaner directly around the silicone dome.", |
|
1248
|
"Depress the rubber dome 20-30 times rapidly to allow the solvent to dissolve sticky residue inside the scissor sliders.", |
|
1249
|
"Absorb dislodged grime and solvent using a microfiber swab." |
|
1250
|
], |
|
1251
|
warnings: ["Do not flood the keyboard with excessive liquid solvent; use controlled, targeted micro-bursts."], |
|
1252
|
tips: ["Electronic contact cleaner evaporates in under 30 seconds leaving zero conductive residue."], |
|
1253
|
checkpoints: ["Scissor mechanism moves up and down freely with zero sticky resistance."], |
|
1254
|
imageUrl: IMAGES.screenTeardown1 |
|
1255
|
}, |
|
1256
|
{ |
|
1257
|
stepNumber: 3, |
|
1258
|
phase: "Phase 3: Hinge Re-latching & Tactile Testing", |
|
1259
|
title: "Scissor Mechanism Alignment & Keycap Snap-In", |
|
1260
|
description: "Align keycap over the scissor mechanism, hook bottom tabs, and press firmly on the center until two audible clicks verify dual-latch engagement.", |
|
1261
|
toolRequired: "Hand assembly", |
|
1262
|
torqueSpec: "Tactile snap", |
|
1263
|
subSteps: [ |
|
1264
|
"Clean the underside of the keycap with an alcohol prep pad.", |
|
1265
|
"Position keycap square over the scissor hinge.", |
|
1266
|
"Engage the bottom hinge hooks first, then press down firmly in the center until you feel and hear two distinct snap clicks.", |
|
1267
|
"Test tactile travel: key should have crisp, uniform 1.3mm travel with immediate spring rebound." |
|
1268
|
], |
|
1269
|
warnings: ["Do not force keycaps down at an angle; if it resists, verify scissor hinge orientation."], |
|
1270
|
tips: ["If a scissor hinge came unhooked from the metal chassis tray, re-hook the bottom metal tabs first."], |
|
1271
|
checkpoints: ["Keycap sits level with neighboring keys with crisp tactile actuation."], |
|
1272
|
imageUrl: IMAGES.cleaningBlower |
|
1273
|
}, |
|
1274
|
{ |
|
1275
|
stepNumber: 4, |
|
1276
|
phase: "Phase 4: Post-Repair Keyboard Matrix Validation", |
|
1277
|
title: "Full 100% Keyboard Matrix Testing & Chattering Check", |
|
1278
|
description: "Power on laptop, launch keyboard tester utility, test every individual key for actuation, and verify zero key chattering (double-typing).", |
|
1279
|
toolRequired: "Keyboard Matrix Tester Utility", |
|
1280
|
torqueSpec: "N/A", |
|
1281
|
subSteps: [ |
|
1282
|
"Power on laptop and boot into OS.", |
|
1283
|
"Open keyboard matrix testing software.", |
|
1284
|
"Press every key on the keyboard, verifying 100% green registration.", |
|
1285
|
"Type rapid test sentences in a text editor to verify zero key bounce or duplicate characters.", |
|
1286
|
"Test keyboard backlight brightness levels (Low, Medium, High, Off)." |
|
1287
|
], |
|
1288
|
warnings: ["If a key registers multiple times per press (chattering), apply one more contact cleaner flush."], |
|
1289
|
tips: ["Set keyboard repeat delay in OS settings to short for optimal typing responsiveness."], |
|
1290
|
checkpoints: ["All keys actuate with 100% reliability and crisp tactile response."], |
|
1291
|
imageUrl: IMAGES.terminal |
|
1292
|
} |
|
1293
|
], |
|
1294
|
imageUrl: IMAGES.cleaningBlower |
|
1295
|
}, |
|
1296
|
|
|
1297
|
{ |
|
1298
|
category: "cleaning" as const, |
|
1299
|
titleSuffix: "VRAM & MOSFET Thermal Pad Caliper Sizing & Renewal", |
|
1300
|
descSuffix: "Start-to-finish thermal pad overhaul: caliper millimeter gap measuring (0.5mm/1.0mm/1.5mm), durometer selection, precision cutting, and core contact spread verification.", |
|
1301
|
difficulty: "medium" as const, |
|
1302
|
estimatedTime: "30-45 min", |
|
1303
|
tools: ["Digital Vernier Caliper", "High-Performance Thermal Pads (12.8 W/mK)", "Precision Cutting Shears", "99% Isopropyl Alcohol", "Torque Screwdriver"], |
|
1304
|
warnings: [ |
|
1305
|
"Using overly thick thermal pads prevents the heatsink from contacting the CPU/GPU silicon dies, leading to instant 105°C thermal shutdowns.", |
|
1306
|
"Always peel the protective plastic backing film from BOTH sides of the replacement thermal pads." |
|
1307
|
], |
|
1308
|
steps: [ |
|
1309
|
{ |
|
1310
|
stepNumber: 1, |
|
1311
|
phase: "Phase 1: Pre-Disassembly Diagnostics & Heatsink Removal", |
|
1312
|
title: "Power Drain, Heatsink Dismount & Old Pad Inspection", |
|
1313
|
description: "Power off machine, decouple battery, remove heatsink assembly, and inspect compressed factory thermal pads on VRAM chips and MOSFET power stages.", |
|
1314
|
toolRequired: "Torx T5 / Phillips #00 & Spudger", |
|
1315
|
torqueSpec: "0.20 Nm", |
|
1316
|
subSteps: [ |
|
1317
|
"Power down system, disconnect AC charger, and disconnect internal battery harness.", |
|
1318
|
"Loosen heatsink screws in reverse stamped sequence (4 -> 3 -> 2 -> 1).", |
|
1319
|
"Lift copper heatsink module straight up.", |
|
1320
|
"Inspect old thermal pads for oil leakage, hardening, or tearing across GDDR6 memory and VRM chokes." |
|
1321
|
], |
|
1322
|
warnings: ["Do not discard old pads immediately; keep them for thickness comparison."], |
|
1323
|
tips: ["Factory thermal pads often dry out and sweat silicone oil after 2 years of thermal cycling."], |
|
1324
|
checkpoints: ["Heatsink extracted cleanly with all chip locations mapped."], |
|
1325
|
imageUrl: IMAGES.thermalPaste |
|
1326
|
}, |
|
1327
|
{ |
|
1328
|
stepNumber: 2, |
|
1329
|
phase: "Phase 2: Vernier Caliper Thickness & Gap Measurement", |
|
1330
|
title: "Millimeter Gap Tolerancing & Precision Pad Cutting", |
|
1331
|
description: "Measure gap between chip packages and copper baseplates using a digital caliper. Cut replacement 12.8 W/mK silicone pads to exact 1:1 chip dimensions.", |
|
1332
|
toolRequired: "Digital Vernier Caliper & Precision Shears", |
|
1333
|
torqueSpec: "N/A", |
|
1334
|
subSteps: [ |
|
1335
|
"Measure uncompressed edge of old thermal pads with digital caliper (typically 0.5mm, 1.0mm, or 1.5mm).", |
|
1336
|
"Select replacement thermal pads with high thermal conductivity (12.8 W/mK) and soft durometer (30-40 Shore 00).", |
|
1337
|
"Cut replacement pad strips to match exact 1:1 rectangular dimensions of VRAM and MOSFET packages using sharp shears.", |
|
1338
|
"Clean old silicone oil residue from memory chips and copper heatsink contact pads with 99% IPA." |
|
1339
|
], |
|
1340
|
warnings: ["Never stack two 0.5mm pads to make 1.0mm as the trapped air interface drastically increases thermal resistance."], |
|
1341
|
tips: ["Using softer durometer pads allows easier compression when tightening heatsink screws."], |
|
1342
|
checkpoints: ["All pad pieces cut to precise chip sizes with correct millimeter thickness."], |
|
1343
|
imageUrl: IMAGES.nvmeSSD |
|
1344
|
}, |
|
1345
|
{ |
|
1346
|
stepNumber: 3, |
|
1347
|
phase: "Phase 3: Dual-Sided Film Peeling & Component Placement", |
|
1348
|
title: "Peel Protective Films & Press Pads onto Target Chips", |
|
1349
|
description: "Peel blue protective backing from both faces of each pad, press onto VRAM memory and VRM power stages, and verify zero overlap with neighboring passives.", |
|
1350
|
toolRequired: "Micro-Tweezers & Lint-Free Gloves", |
|
1351
|
torqueSpec: "Hand placement", |
|
1352
|
subSteps: [ |
|
1353
|
"Peel the bottom protective plastic film from each pad.", |
|
1354
|
"Position pad accurately onto each GDDR6 memory chip and VRM MOSFET choke.", |
|
1355
|
"Press lightly with a gloved finger to adhere pad to the chip package.", |
|
1356
|
"Peel the top clear protective film from the upper face of all installed pads.", |
|
1357
|
"Apply Arctic MX-6 thermal compound to the central CPU and GPU silicon dies." |
|
1358
|
], |
|
1359
|
warnings: ["Leaving the top clear protective film on thermal pads will insulate heat and cause VRAM to burn out."], |
|
1360
|
tips: ["Count the peeled plastic backing pieces to ensure 100% of films were removed."], |
|
1361
|
checkpoints: ["All thermal pads installed with both protective films peeled and dies repasted."], |
|
1362
|
imageUrl: IMAGES.thermalPaste |
|
1363
|
}, |
|
1364
|
{ |
|
1365
|
stepNumber: 4, |
|
1366
|
phase: "Phase 4: Heatsink Mounting, Torque & Spread Inspection", |
|
1367
|
title: "Sequential Heatsink Torquing & Core Die Contact Verification", |
|
1368
|
description: "Lower heatsink assembly flat, torque screws in stamped sequence (1-2-3-4), and inspect from side angle to confirm zero gap between heatsink and CPU/GPU dies.", |
|
1369
|
toolRequired: "Torque Screwdriver & Inspection Light", |
|
1370
|
torqueSpec: "0.20 Nm (Sequential 1-2-3-4)", |
|
1371
|
subSteps: [ |
|
1372
|
"Lower copper cooling assembly straight down onto the board without twisting.", |
|
1373
|
"Tighten screws in stamped numerical sequence (1 -> 2 -> 3 -> 4) to 0.20 Nm.", |
|
1374
|
"Inspect the gap between copper baseplate and CPU/GPU silicon dies using a flashlight.", |
|
1375
|
"Verify the thermal pads have compressed by ~25-30% and the central copper coldplate is sitting 100% flush against the silicon die.", |
|
1376
|
"Plug in both fan PWM cables." |
|
1377
|
], |
|
1378
|
warnings: ["If heatsink rocks or tilts, an oversized thermal pad is preventing proper die seating; remove and downsize by 0.5mm."], |
|
1379
|
tips: ["Perform a dry test-mount with thermal paste to inspect the paste spread pattern on the die."], |
|
1380
|
checkpoints: ["100% flush die contact verified with zero heatsink tilt."], |
|
1381
|
imageUrl: IMAGES.thermalPaste |
|
1382
|
}, |
|
1383
|
{ |
|
1384
|
stepNumber: 5, |
|
1385
|
phase: "Phase 5: Reassembly & VRAM Thermal Stress Verification", |
|
1386
|
title: "Chassis Assembly & FurMark / VRAM Temperature Logging", |
|
1387
|
description: "Reconnect battery, fasten bottom enclosure, boot into Windows, launch HWiNFO64, and log GPU Memory Junction & Hotspot temperatures under 15-minute load.", |
|
1388
|
toolRequired: "HWiNFO64 & FurMark / 3DMark", |
|
1389
|
torqueSpec: "0.20 Nm", |
|
1390
|
subSteps: [ |
|
1391
|
"Reconnect internal battery harness and screw down bottom casing.", |
|
1392
|
"Boot into Windows and launch HWiNFO64 sensor logger.", |
|
1393
|
"Run FurMark GPU stress test for 15 minutes.", |
|
1394
|
"Monitor `GPU Memory Junction Temperature` (should stay <85°C) and `GPU Hotspot Temperature` (delta over GPU Core should be <15°C).", |
|
1395
|
"Confirm zero artifacts, throttling, or driver crashes." |
|
1396
|
], |
|
1397
|
warnings: ["If GPU Memory Junction exceeds 100°C, immediately shut down and inspect pad thickness."], |
|
1398
|
tips: ["A healthy thermal pad upgrade lowers VRAM temperatures by 15-25°C under heavy raytracing workloads."], |
|
1399
|
checkpoints: ["GPU Core <72°C and VRAM Memory <80°C under maximum sustained load."], |
|
1400
|
imageUrl: IMAGES.osRecovery |
|
1401
|
} |
|
1402
|
], |
|
1403
|
imageUrl: IMAGES.thermalPaste |
|
1404
|
}, |
|
1405
|
|
|
1406
|
// ---------------------------------------------------- |
|
1407
|
// UPGRADES (3 Templates) |
|
1408
|
// ---------------------------------------------------- |
|
1409
|
{ |
|
1410
|
category: "upgrades" as const, |
|
1411
|
titleSuffix: "PCIe 4.0 / 5.0 NVMe SSD Expansion & Sector Cloning", |
|
1412
|
descSuffix: "Start-to-finish high-speed storage upgrade: external enclosure cloning, 30-degree M.2 slot insertion, thermal heatsink mounting, UEFI boot priority, and TRIM optimization.", |
|
1413
|
difficulty: "easy" as const, |
|
1414
|
estimatedTime: "25-35 min", |
|
1415
|
tools: ["Phillips #00 Precision Screwdriver", "M.2 2280 NVMe SSD", "USB-C External NVMe Enclosure", "Drive Cloning Software (Macrium Reflect / Clonezilla)", "Thermal Pad"], |
|
1416
|
warnings: [ |
|
1417
|
"Touch a grounded metal chassis or wear an ESD wrist strap before handling bare NVMe SSD circuit boards.", |
|
1418
|
"Insert M.2 NVMe SSDs into the socket at a 30-degree angle; never force straight down horizontally or you will break the M.2 Key-M connector pins." |
|
1419
|
], |
|
1420
|
steps: [ |
|
1421
|
{ |
|
1422
|
stepNumber: 1, |
|
1423
|
phase: "Phase 1: Drive Sector Cloning & BitLocker Decryption", |
|
1424
|
title: "Drive Cloning to Replacement NVMe via External Enclosure", |
|
1425
|
description: "Insert new NVMe SSD into a USB-C external enclosure, connect to laptop, temporarily suspend BitLocker encryption, and clone all partitions sector-by-sector.", |
|
1426
|
toolRequired: "USB-C NVMe Enclosure & Macrium Reflect", |
|
1427
|
torqueSpec: "N/A", |
|
1428
|
subSteps: [ |
|
1429
|
"Suspend BitLocker encryption on target OS drive in Windows (`manage-bde -protectors -disable C:`).", |
|
1430
|
"Install new NVMe SSD into USB-C external NVMe enclosure and plug into laptop.", |
|
1431
|
"Launch Macrium Reflect or Clonezilla.", |
|
1432
|
"Select source drive > Click `Clone this disk` > Select destination NVMe drive.", |
|
1433
|
"Drag all partitions (EFI, MSR, Windows OS, Recovery) to destination and extend OS partition to fill total drive capacity.", |
|
1434
|
"Execute clone process and wait for 100% completion verification." |
|
1435
|
], |
|
1436
|
warnings: ["Ensure you select the correct source vs destination drive to avoid overwriting active data."], |
|
1437
|
tips: ["Suspending BitLocker before cloning prevents drive locked prompt on first boot."], |
|
1438
|
checkpoints: ["Cloning process finishes with 100% verified partition copies."], |
|
1439
|
imageUrl: IMAGES.nvmeSSD |
|
1440
|
}, |
|
1441
|
{ |
|
1442
|
stepNumber: 2, |
|
1443
|
phase: "Phase 2: Power Isolation & Chassis Opening", |
|
1444
|
title: "Power Isolation & Motherboard Battery Decoupling", |
|
1445
|
description: "Power down laptop, disconnect AC adapter, remove bottom enclosure, and physically disconnect the internal battery power harness.", |
|
1446
|
toolRequired: "Torx T5 / Phillips #00 & Spudger", |
|
1447
|
torqueSpec: "0.20 Nm", |
|
1448
|
subSteps: [ |
|
1449
|
"Shut down computer and unplug all external cables.", |
|
1450
|
"Remove bottom casing fasteners and release perimeter clips.", |
|
1451
|
"Disconnect the internal battery connector from the logic board.", |
|
1452
|
"Locate the M.2 2280 NVMe slot (and remove copper EMI shield if present)." |
|
1453
|
], |
|
1454
|
warnings: ["Never insert or remove NVMe cards while the battery is connected to prevent +3.3V power surge shorts."], |
|
1455
|
tips: ["If the laptop has two M.2 slots, check the motherboard silkscreen for `PCIE GEN4 / GEN5` labeling on Slot 1."], |
|
1456
|
checkpoints: ["Battery disconnected and M.2 slot accessible."], |
|
1457
|
imageUrl: IMAGES.screenTeardown1 |
|
1458
|
}, |
|
1459
|
{ |
|
1460
|
stepNumber: 3, |
|
1461
|
phase: "Phase 3: M.2 NVMe Slot Installation & Heatsink Securing", |
|
1462
|
title: "30-Degree Angle Slot Insertion, Standoff Fastener & Heatsink Mounting", |
|
1463
|
description: "Insert the new NVMe SSD firmly into the M.2 Key-M slot at a 30-degree angle, press down gently, fasten the M2x3mm retention screw, and attach copper thermal shield.", |
|
1464
|
toolRequired: "Phillips #00 Screwdriver", |
|
1465
|
torqueSpec: "0.15 Nm (M2 Screw)", |
|
1466
|
subSteps: [ |
|
1467
|
"Align module notch with M.2 Key-M socket key.", |
|
1468
|
"Slide NVMe card firmly into the socket at a 30-degree upward angle until gold contacts are fully seated.", |
|
1469
|
"Gently press the card down flat against the chassis standoff post.", |
|
1470
|
"Install and tighten the single M2x3.5mm retention screw to 0.15 Nm.", |
|
1471
|
"Apply 1.0mm thermal pad over the NVMe controller and attach the metal heatsink shield." |
|
1472
|
], |
|
1473
|
warnings: ["Do not over-tighten the tiny M2 screw; excessive torque strips the soft brass standoff thread."], |
|
1474
|
tips: ["High-speed Gen4/Gen5 SSD controllers require thermal pads to prevent thermal throttling above 75°C."], |
|
1475
|
checkpoints: ["SSD sits completely flat and secure with thermal shield attached."], |
|
1476
|
imageUrl: IMAGES.nvmeSSD |
|
1477
|
}, |
|
1478
|
{ |
|
1479
|
stepNumber: 4, |
|
1480
|
phase: "Phase 4: Chassis Reassembly & UEFI Boot Priority", |
|
1481
|
title: "Battery Reconnection, Chassis Closure & UEFI Boot Setup", |
|
1482
|
description: "Reconnect battery, fasten bottom cover, power on, enter BIOS Setup, and ensure the new NVMe SSD is designated as Primary Boot Option #1.", |
|
1483
|
toolRequired: "Torx T5 / Phillips #00 & BIOS Setup", |
|
1484
|
torqueSpec: "0.20 Nm", |
|
1485
|
subSteps: [ |
|
1486
|
"Reconnect internal battery harness and snap bottom cover in place.", |
|
1487
|
"Fasten all perimeter chassis screws.", |
|
1488
|
"Power on system and tap F2/Del to enter BIOS Setup.", |
|
1489
|
"Navigate to `Boot Options` > set new NVMe SSD (Windows Boot Manager) as `Boot Option #1`.", |
|
1490
|
"Save changes and exit BIOS." |
|
1491
|
], |
|
1492
|
warnings: ["If system boots to 'No Boot Device Found', verify UEFI boot mode is enabled instead of Legacy CSM."], |
|
1493
|
tips: ["Enable NVMe Fast Boot in BIOS for sub-6 second cold boot times."], |
|
1494
|
checkpoints: ["BIOS recognizes new NVMe model and serial with correct capacity."], |
|
1495
|
imageUrl: IMAGES.biosScreen |
|
1496
|
}, |
|
1497
|
{ |
|
1498
|
stepNumber: 5, |
|
1499
|
phase: "Phase 5: Post-Repair TRIM Verification & Speed Benchmark", |
|
1500
|
title: "Windows Disk Management, TRIM Verification & CrystalDiskMark Speed Test", |
|
1501
|
description: "Boot into Windows, verify partition expansion in Disk Management, enable TRIM garbage collection, and benchmark read/write speeds with CrystalDiskMark.", |
|
1502
|
toolRequired: "Disk Management & CrystalDiskMark", |
|
1503
|
torqueSpec: "N/A", |
|
1504
|
subSteps: [ |
|
1505
|
"Boot into Windows desktop.", |
|
1506
|
"Open Disk Management (`diskmgmt.msc`) and verify full unallocated drive capacity is merged into C: drive.", |
|
1507
|
"Open Admin Command Prompt and run `fsutil behavior query DisableDeleteNotify` (output `0` confirms TRIM is active).", |
|
1508
|
"Launch CrystalDiskMark and run 1GB read/write benchmark.", |
|
1509
|
"Verify sequential read speeds reach rated spec (PCIe 4.0: ~7,000 MB/s, PCIe 5.0: ~12,000 MB/s).", |
|
1510
|
"Re-enable BitLocker encryption (`manage-bde -protectors -enable C:`)." |
|
1511
|
], |
|
1512
|
warnings: ["Do not run defragmentation on NVMe SSDs; only use TRIM optimization."], |
|
1513
|
tips: ["Install OEM SSD management software (Samsung Magician / WD Dashboard) for firmware updates."], |
|
1514
|
checkpoints: ["Sequential reads exceed 7,000 MB/s with full capacity accessible."], |
|
1515
|
imageUrl: IMAGES.osRecovery |
|
1516
|
} |
|
1517
|
], |
|
1518
|
imageUrl: IMAGES.nvmeSSD |
|
1519
|
}, |
|
1520
|
|
|
1521
|
{ |
|
1522
|
category: "upgrades" as const, |
|
1523
|
titleSuffix: "DDR4 / DDR5 Dual-Channel High-Speed RAM Upgrade", |
|
1524
|
descSuffix: "Start-to-finish memory expansion: isolate power, remove EMI shielding, eject legacy modules, insert matched dual-rank SODIMMs, POST memory training, and MemTest86 validation.", |
|
1525
|
difficulty: "easy" as const, |
|
1526
|
estimatedTime: "15-20 min", |
|
1527
|
tools: ["Plastic Spudger", "Matched Dual-Rank DDR5 SODIMM Memory Kit", "Anti-Static Wrist Strap", "Phillips #00 Screwdriver", "PassMark MemTest86 USB"], |
|
1528
|
warnings: [ |
|
1529
|
"Ensure laptop is completely powered off and internal battery disconnected before touching memory slots.", |
|
1530
|
"DDR5 and DDR4 slots have different notch keying; never force a DDR5 module into a DDR4 socket." |
|
1531
|
], |
|
1532
|
steps: [ |
|
1533
|
{ |
|
1534
|
stepNumber: 1, |
|
1535
|
phase: "Phase 1: Pre-Disassembly Diagnostics & Battery Decoupling", |
|
1536
|
title: "Power Drain, Enclosure Removal & Battery Isolation", |
|
1537
|
description: "Shut down laptop, disconnect AC power, remove bottom enclosure, disconnect internal battery harness, and ground yourself on an ESD workstation.", |
|
1538
|
toolRequired: "Torx T5 / Phillips #00 & Spudger", |
|
1539
|
torqueSpec: "0.20 Nm", |
|
1540
|
subSteps: [ |
|
1541
|
"Power off computer and disconnect all external cables.", |
|
1542
|
"Remove bottom casing screws and pop perimeter retaining clips.", |
|
1543
|
"Disconnect the internal battery connector from the motherboard.", |
|
1544
|
"Hold power button for 10 seconds to drain standby voltage from motherboard memory rails." |
|
1545
|
], |
|
1546
|
warnings: ["Touching RAM slots while the battery is connected can bridge VDD/VDDQ power pins and destroy memory controllers."], |
|
1547
|
tips: ["Always install matched pairs (same capacity, speed, and CAS latency) for optimal dual-channel bandwidth."], |
|
1548
|
checkpoints: ["Battery disconnected and memory shielding visible."], |
|
1549
|
imageUrl: IMAGES.screenTeardown1 |
|
1550
|
}, |
|
1551
|
{ |
|
1552
|
stepNumber: 2, |
|
1553
|
phase: "Phase 2: EMI Shield Removal & Legacy Module Ejection", |
|
1554
|
title: "Metal EMI Shield Removal & Module Ejection", |
|
1555
|
description: "Pry away the metal EMI memory canopy and spread the side metal retention clips outward to allow the SODIMM module to pop up at a 45-degree angle.", |
|
1556
|
toolRequired: "Plastic Spudger", |
|
1557
|
torqueSpec: "Hand-release", |
|
1558
|
subSteps: [ |
|
1559
|
"Use a plastic spudger to gently release the stamped metal EMI shielding canopy covering the RAM slots.", |
|
1560
|
"Spread the two metal spring retention clips on the sides of the SODIMM slot outward simultaneously.", |
|
1561
|
"The RAM module will automatically pop upward at a 45-degree angle.", |
|
1562
|
"Grasp the edges of the module and slide it straight out of the socket." |
|
1563
|
], |
|
1564
|
warnings: ["Never touch the gold connector pins with bare fingers to avoid transferring skin oils and causing memory bit errors."], |
|
1565
|
tips: ["Store extracted RAM modules in anti-static ESD bags."], |
|
1566
|
checkpoints: ["Old modules extracted cleanly without bending side retention clips."], |
|
1567
|
imageUrl: IMAGES.ramModule |
|
1568
|
}, |
|
1569
|
{ |
|
1570
|
stepNumber: 3, |
|
1571
|
phase: "Phase 3: Dual-Rank SODIMM Insertion & Latching", |
|
1572
|
title: "New SODIMM Alignment, Insertion & Latch Engagement", |
|
1573
|
description: "Align module notch with socket key, slide firmly into the slot at 45 degrees, and push flat until side metal clips snap locked with an audible click.", |
|
1574
|
toolRequired: "Hand assembly", |
|
1575
|
torqueSpec: "Tactile snap", |
|
1576
|
subSteps: [ |
|
1577
|
"Align the notch on the gold connector edge of the new DDR5 module with the plastic key in the SODIMM socket.", |
|
1578
|
"Insert the module firmly into the slot at a 45-degree angle until gold pins are fully seated inside the connector.", |
|
1579
|
"Press the top edge of the module down flat towards the motherboard until both side metal retention clips snap locked with a tactile click.", |
|
1580
|
"Repeat for Slot 2 to populate dual-channel symmetrical configuration.", |
|
1581
|
"Re-seat the metal EMI shielding canopy over the memory modules." |
|
1582
|
], |
|
1583
|
warnings: ["If side clips do not snap freely, do not force down; re-align module angle and re-insert."], |
|
1584
|
tips: ["Verify module is fully seated by checking that gold pins are almost completely hidden inside the socket."], |
|
1585
|
checkpoints: ["Both modules locked flat and level under side retention springs."], |
|
1586
|
imageUrl: IMAGES.ramModule |
|
1587
|
}, |
|
1588
|
{ |
|
1589
|
stepNumber: 4, |
|
1590
|
phase: "Phase 4: Reassembly & DDR5 Cold POST Memory Training", |
|
1591
|
title: "Battery Connection, Chassis Closure & Initial Memory Training", |
|
1592
|
description: "Reconnect battery, fasten bottom cover, connect AC charger, power on, and allow up to 60-90 seconds for initial DDR5 memory training.", |
|
1593
|
toolRequired: "Torx T5 / Phillips #00 & AC Charger", |
|
1594
|
torqueSpec: "0.20 Nm", |
|
1595
|
subSteps: [ |
|
1596
|
"Reconnect internal battery harness to the motherboard.", |
|
1597
|
"Snap bottom enclosure in place and torque all perimeter screws.", |
|
1598
|
"Connect OEM AC power adapter and press the power button.", |
|
1599
|
"CRITICAL: Allow 30 to 90 seconds for initial DDR5 memory training. The screen will remain black and power LED will pulse while the memory controller calibrates timings.", |
|
1600
|
"Wait patiently until the OEM logo appears, then tap F2/Del to enter BIOS Setup." |
|
1601
|
], |
|
1602
|
warnings: ["DO NOT force power off while memory training is running on first boot."], |
|
1603
|
tips: ["DDR5 trains JEDEC timing parameters and signal termination resistances automatically on hardware changes."], |
|
1604
|
checkpoints: ["BIOS Setup displays full upgraded memory capacity (e.g. 32GB / 64GB) at rated frequency (e.g. 5600 MT/s)."], |
|
1605
|
imageUrl: IMAGES.biosScreen |
|
1606
|
}, |
|
1607
|
{ |
|
1608
|
stepNumber: 5, |
|
1609
|
phase: "Phase 5: Post-Repair Diagnostic Stress Test & MemTest86", |
|
1610
|
title: "PassMark MemTest86 4-Pass Stress Test & Windows Memory Diagnostics", |
|
1611
|
description: "Boot from MemTest86 USB drive, run a 4-pass comprehensive memory test (zero bit errors), boot into Windows, and verify dual-channel bandwidth in CPU-Z.", |
|
1612
|
toolRequired: "PassMark MemTest86 USB & CPU-Z", |
|
1613
|
torqueSpec: "N/A", |
|
1614
|
subSteps: [ |
|
1615
|
"Insert MemTest86 bootable USB drive and boot from UEFI boot menu.", |
|
1616
|
"Run full 4-pass diagnostic test checking Test 1 through Test 13 (Address test, Moving inversions, Block move, Rowhammer).", |
|
1617
|
"Confirm zero bit errors reported (0 Errors).", |
|
1618
|
"Boot into Windows and launch CPU-Z (`Memory` tab).", |
|
1619
|
"Verify `Channel #` reports `2 x 32-bit` (Dual-Channel) and frequency matches JEDEC/XMP specifications." |
|
1620
|
], |
|
1621
|
warnings: ["If MemTest86 reports even a single bit error, reseat modules or check for incompatible CAS latency."], |
|
1622
|
tips: ["Run heavy multi-tasking workloads with 50+ browser tabs and 4K video rendering to test stability."], |
|
1623
|
checkpoints: ["100% zero errors in MemTest86 with full dual-channel bandwidth verified."], |
|
1624
|
imageUrl: IMAGES.ramModule |
|
1625
|
} |
|
1626
|
], |
|
1627
|
imageUrl: IMAGES.ramModule |
|
1628
|
}, |
|
1629
|
|
|
1630
|
{ |
|
1631
|
category: "upgrades" as const, |
|
1632
|
titleSuffix: "Wi-Fi 7 / Wi-Fi 6E BE200 M.2 Wireless Module & Antenna Upgrade", |
|
1633
|
descSuffix: "Start-to-finish wireless upgrade: isolate power, decouple micro IPEX MHF4 antenna snaps, insert M.2 Key-E card, snap antenna leads, install WHQL drivers, and verify 320MHz channels.", |
|
1634
|
difficulty: "easy" as const, |
|
1635
|
estimatedTime: "15-20 min", |
|
1636
|
tools: ["Phillips #00 Screwdriver", "Plastic Spudger / Nylon Tweezers", "Wi-Fi 7 BE200 M.2 2230 Card", "Anti-Static Wrist Strap", "Official Intel/Qualcomm Wi-Fi 7 Driver Package"], |
|
1637
|
warnings: [ |
|
1638
|
"Carefully press micro IPEX MHF4 antenna snaps straight down from above; NEVER slide sideways or push with metal tools to avoid crushing delicate connector gold center pins." |
|
1639
|
], |
|
1640
|
steps: [ |
|
1641
|
{ |
|
1642
|
stepNumber: 1, |
|
1643
|
phase: "Phase 1: Pre-Disassembly Diagnostics & Battery Isolation", |
|
1644
|
title: "Power Drain, Enclosure Removal & Battery Disconnection", |
|
1645
|
description: "Power down laptop, disconnect AC adapter, remove bottom enclosure, disconnect internal battery harness, and ground yourself on an ESD workstation.", |
|
1646
|
toolRequired: "Torx T5 / Phillips #00 & Spudger", |
|
1647
|
torqueSpec: "0.20 Nm", |
|
1648
|
subSteps: [ |
|
1649
|
"Power off computer and disconnect all external cables.", |
|
1650
|
"Remove bottom casing screws and pop perimeter retaining clips.", |
|
1651
|
"Disconnect the internal battery connector from the motherboard.", |
|
1652
|
"Locate the M.2 2230 Key-E Wi-Fi module socket." |
|
1653
|
], |
|
1654
|
warnings: ["Disconnect battery before touching wireless card to prevent shorting antenna ground planes."], |
|
1655
|
tips: ["Note which antenna wire connects to `Main` (Black/Triangle 1) and `Aux` (White/Triangle 2)."], |
|
1656
|
checkpoints: ["Battery disconnected and Wi-Fi module accessible."], |
|
1657
|
imageUrl: IMAGES.screenTeardown1 |
|
1658
|
}, |
|
1659
|
{ |
|
1660
|
stepNumber: 2, |
|
1661
|
phase: "Phase 2: Antenna Decoupling & Module Extraction", |
|
1662
|
title: "IPEX MHF4 Antenna Decoupling & Standoff Screw Removal", |
|
1663
|
description: "Lift IPEX MHF4 micro antenna leads straight up with nylon tweezers, remove the single M2x3mm standoff screw, and slide the old Wi-Fi card out at 30 degrees.", |
|
1664
|
toolRequired: "Nylon Tweezers & Phillips #00", |
|
1665
|
torqueSpec: "0.15 Nm", |
|
1666
|
subSteps: [ |
|
1667
|
"Peel back clear protective Mylar tape covering the antenna connectors.", |
|
1668
|
"Insert nylon tweezers under the metal collar of the Black (Main) antenna snap and lift vertically straight up.", |
|
1669
|
"Repeat for White/Gray (Aux) antenna snap.", |
|
1670
|
"Remove the single M2x3mm Phillips screw holding the card in the standoff.", |
|
1671
|
"Slide the old Wi-Fi card out of the M.2 Key-E slot at a 30-degree angle." |
|
1672
|
], |
|
1673
|
warnings: ["Do not pull antenna leads by the coaxial wire; always pry under the metal gold connector head."], |
|
1674
|
tips: ["Store old Wi-Fi card in an anti-static bag for testing backup."], |
|
1675
|
checkpoints: ["Antenna leads disconnected with gold micro-pins in pristine condition."], |
|
1676
|
imageUrl: IMAGES.logicBoard |
|
1677
|
}, |
|
1678
|
{ |
|
1679
|
stepNumber: 3, |
|
1680
|
phase: "Phase 3: Wi-Fi 7 Module Insertion & Antenna Snapping", |
|
1681
|
title: "Wi-Fi 7 M.2 Card Insertion & Precision Antenna Latching", |
|
1682
|
description: "Slide new Wi-Fi 7 BE200 module into Key-E slot, fasten M2 screw, align micro antenna snaps over gold pads, and press straight down until tactile snap confirms engagement.", |
|
1683
|
toolRequired: "Phillips #00 & Fingertip / Nylon Tool", |
|
1684
|
torqueSpec: "0.15 Nm", |
|
1685
|
subSteps: [ |
|
1686
|
"Insert new Wi-Fi 7 card into the M.2 Key-E slot at a 30-degree angle and press flat against standoff.", |
|
1687
|
"Fasten the M2x3mm screw to 0.15 Nm.", |
|
1688
|
"Align the Black (Main) antenna connector precisely over Pin 1 on the Wi-Fi card.", |
|
1689
|
"Press straight down gently with a fingertip or nylon spudger until you feel a distinct micro-snap click.", |
|
1690
|
"Align and snap the White/Gray (Aux) antenna connector onto Pin 2.", |
|
1691
|
"Place protective insulating tape over antenna leads." |
|
1692
|
], |
|
1693
|
warnings: ["If antenna does not click immediately, re-center; pushing off-center crushes the female barrel."], |
|
1694
|
tips: ["Test antenna retention by giving the wire a very gentle tug; it should stay locked firmly."], |
|
1695
|
checkpoints: ["Both antenna leads locked securely and flat on the Wi-Fi card."], |
|
1696
|
imageUrl: IMAGES.logicBoard |
|
1697
|
}, |
|
1698
|
{ |
|
1699
|
stepNumber: 4, |
|
1700
|
phase: "Phase 4: Chassis Closure & Driver Installation", |
|
1701
|
title: "Chassis Assembly, Boot-up & OEM WHQL Driver Setup", |
|
1702
|
description: "Reconnect battery, fasten bottom enclosure, boot into Windows, and install the latest official Intel / Qualcomm Wi-Fi 7 and Bluetooth 5.4 driver package.", |
|
1703
|
toolRequired: "Torx T5 / Phillips #00 & Driver Setup", |
|
1704
|
torqueSpec: "0.20 Nm", |
|
1705
|
subSteps: [ |
|
1706
|
"Reconnect internal battery harness and snap bottom cover in place.", |
|
1707
|
"Torque perimeter chassis screws.", |
|
1708
|
"Boot into Windows desktop.", |
|
1709
|
"Launch the official Wi-Fi 7 driver installer package (e.g. `Intel_WiFi_BE200_WHQL.exe`).", |
|
1710
|
"Launch the official Bluetooth driver installer package (`Intel_BT_WHQL.exe`) and restart system." |
|
1711
|
], |
|
1712
|
warnings: ["Make sure both Wi-Fi and Bluetooth driver packages are installed for full combo card functionality."], |
|
1713
|
tips: ["Bluetooth communicates over internal USB pins on the M.2 Key-E slot."], |
|
1714
|
checkpoints: ["Device Manager shows 'Intel(R) Wi-Fi 7 BE200 320MHz' and 'Intel(R) Wireless Bluetooth(R)' with zero warnings."], |
|
1715
|
imageUrl: IMAGES.osRecovery |
|
1716
|
}, |
|
1717
|
{ |
|
1718
|
stepNumber: 5, |
|
1719
|
phase: "Phase 5: Post-Repair Wireless Throughput & Latency Testing", |
|
1720
|
title: "6GHz Tri-Band Connection, Throughput & Bluetooth Peripheral QA", |
|
1721
|
description: "Connect to 6GHz Wi-Fi 7 / 6E network, verify 320MHz channel width, test gigabit throughput, and pair high-resolution Bluetooth 5.4 peripherals.", |
|
1722
|
toolRequired: "Wi-Fi Analyzer & Speedtest", |
|
1723
|
torqueSpec: "N/A", |
|
1724
|
subSteps: [ |
|
1725
|
"Click Wi-Fi icon in taskbar and connect to your 6GHz Wi-Fi 7 SSID.", |
|
1726
|
"Open Command Prompt and run `netsh wlan show interfaces`.", |
|
1727
|
"Confirm `Radio type` displays `802.11be` or `802.11ax` and `Receive rate (Mbps)` shows multi-gigabit link rates (2,400 - 5,800 Mbps).", |
|
1728
|
"Run a local LAN iPerf3 or internet speed test to confirm sub-3ms latency and full gigabit+ throughput.", |
|
1729
|
"Pair Bluetooth headphones/mouse and verify uninterrupted audio streaming at 10-meter range." |
|
1730
|
], |
|
1731
|
warnings: ["If signal strength is weak (-85 dBm), open chassis and verify antenna cables are not swapped or detached."], |
|
1732
|
tips: ["Wi-Fi 7 Multi-Link Operation (MLO) transmits across 5GHz and 6GHz simultaneously for ultra-low latency."], |
|
1733
|
checkpoints: ["Full Wi-Fi 7 multi-gigabit speed achieved with crystal clear Bluetooth audio."], |
|
1734
|
imageUrl: IMAGES.terminal |
|
1735
|
} |
|
1736
|
], |
|
1737
|
imageUrl: IMAGES.logicBoard |
|
1738
|
} |
|
1739
|
]; |
|
1740
|
|
|
1741
|
// Specific 28+ Models to generate targeted technical guides across all 4 categories |
|
1742
|
export const modelTargets = [ |
|
1743
|
// Apple |
|
1744
|
{ brand: "Apple", model: "MacBook Pro 16\" M3 Max", type: "laptop" as const }, |
|
1745
|
{ brand: "Apple", model: "MacBook Pro 14\" M3 Pro", type: "laptop" as const }, |
|
1746
|
{ brand: "Apple", model: "MacBook Air 15\" M2 / M3", type: "laptop" as const }, |
|
1747
|
{ brand: "Apple", model: "MacBook Air 13\" M1 Legacy", type: "laptop" as const }, |
|
1748
|
{ brand: "Apple", model: "Mac Studio M2 Ultra", type: "desktop" as const }, |
|
1749
|
{ brand: "Apple", model: "iMac 24\" 4.5K Retina M3", type: "desktop" as const }, |
|
1750
|
{ brand: "Apple", model: "Mac mini M2 Pro", type: "desktop" as const }, |
|
1751
|
|
|
1752
|
// Dell |
|
1753
|
{ brand: "Dell", model: "XPS 15 9530", type: "laptop" as const }, |
|
1754
|
{ brand: "Dell", model: "XPS 13 Plus 9320", type: "laptop" as const }, |
|
1755
|
{ brand: "Dell", model: "Latitude 5440 Enterprise", type: "laptop" as const }, |
|
1756
|
{ brand: "Dell", model: "Alienware m16 R2 Gaming", type: "laptop" as const }, |
|
1757
|
{ brand: "Dell", model: "OptiPlex 7010 Micro", type: "desktop" as const }, |
|
1758
|
{ brand: "Dell", model: "OptiPlex 5090 SFF", type: "desktop" as const }, |
|
1759
|
{ brand: "Dell", model: "Alienware Aurora R16", type: "desktop" as const }, |
|
1760
|
|
|
1761
|
// Lenovo |
|
1762
|
{ brand: "Lenovo", model: "ThinkPad X1 Carbon Gen 11", type: "laptop" as const }, |
|
1763
|
{ brand: "Lenovo", model: "ThinkPad T14 Gen 4", type: "laptop" as const }, |
|
1764
|
{ brand: "Lenovo", model: "Legion Pro 7i Gen 9", type: "laptop" as const }, |
|
1765
|
{ brand: "Lenovo", model: "Yoga 9i Dual-Screen", type: "laptop" as const }, |
|
1766
|
{ brand: "Lenovo", model: "ThinkCentre M90q Tiny", type: "desktop" as const }, |
|
1767
|
{ brand: "Lenovo", model: "Legion Tower 7i", type: "desktop" as const }, |
|
1768
|
|
|
1769
|
// HP |
|
1770
|
{ brand: "HP", model: "Spectre x360 14 (2024)", type: "laptop" as const }, |
|
1771
|
{ brand: "HP", model: "EliteBook 840 G10", type: "laptop" as const }, |
|
1772
|
{ brand: "HP", model: "OMEN Transcend 16", type: "laptop" as const }, |
|
1773
|
{ brand: "HP", model: "OMEN 45L Cryo-Chamber", type: "desktop" as const }, |
|
1774
|
{ brand: "HP", model: "ProDesk 600 G6 SFF", type: "desktop" as const }, |
|
1775
|
|
|
1776
|
// ASUS |
|
1777
|
{ brand: "ASUS", model: "ROG Zephyrus G14 (2024)", type: "laptop" as const }, |
|
1778
|
{ brand: "ASUS", model: "ZenBook 14 OLED UX3405", type: "laptop" as const }, |
|
1779
|
{ brand: "ASUS", model: "ROG Strix SCAR 16", type: "laptop" as const }, |
|
1780
|
{ brand: "ASUS", model: "ROG Strix G16CH Desktop", type: "desktop" as const }, |
|
1781
|
|
|
1782
|
// Acer & MSI & Razer & Microsoft & Framework & Custom |
|
1783
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{ brand: "Acer", model: "Predator Helios 16", type: "laptop" as const }, |
|
1784
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{ brand: "MSI", model: "Stealth 16 AI Studio", type: "laptop" as const }, |
|
1785
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{ brand: "Razer", model: "Blade 16 Dual-Mode", type: "laptop" as const }, |
|
1786
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{ brand: "Microsoft", model: "Surface Laptop 5", type: "laptop" as const }, |
|
1787
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{ brand: "Framework", model: "Framework Laptop 13 / 16 Modular", type: "laptop" as const }, |
|
1788
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{ brand: "Samsung", model: "Galaxy Book4 Ultra", type: "laptop" as const }, |
|
1789
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{ brand: "LG", model: "LG Gram 17 Pro", type: "laptop" as const }, |
|
1790
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{ brand: "Custom Built", model: "Custom Full/Mid ATX Gaming PC", type: "desktop" as const }, |
|
1791
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{ brand: "Custom Built", model: "Mini-ITX Small Form Factor SFF", type: "desktop" as const } |
|
1792
|
]; |
|
1793
|
|
|
1794
|
/** |
|
1795
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* Returns the entire array of 200+ comprehensive repair guides with intimate details |
|
1796
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*/ |
|
1797
|
export function generateAllComprehensiveGuides(): InsertRepairGuide[] { |
|
1798
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const list: InsertRepairGuide[] = [...curatedRepairGuides]; |
|
1799
|
|
|
1800
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for (const target of modelTargets) { |
|
1801
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for (const template of guideTemplates) { |
|
1802
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list.push({ |
|
1803
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title: `${target.model}: ${template.titleSuffix}`, |
|
1804
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description: `Dedicated start-to-finish ${template.category} teardown and repair protocol for the ${target.brand} ${target.model}. ${template.descSuffix}`, |
|
1805
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deviceType: target.type, |
|
1806
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category: template.category, |
|
1807
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difficulty: template.difficulty, |
|
1808
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estimatedTime: template.estimatedTime, |
|
1809
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toolsRequired: template.tools, |
|
1810
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safetyWarnings: template.warnings, |
|
1811
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steps: template.steps, |
|
1812
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alternativeSolutions: `Reference ${target.brand} official factory service manuals, board-level schematics, or contact certified bench technicians for OEM warranty support.`, |
|
1813
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imageUrl: template.imageUrl |
|
1814
|
}); |
|
1815
|
} |
|
1816
|
} |
|
1817
|
|
|
1818
|
return list; |
|
1819
|
} |
|
1820
|
|
|
1821
|
export async function seedGuides() { |
|
1822
|
const existingGuides = await storage.getRepairGuides(); |
|
1823
|
if (existingGuides.length >= 180 && existingGuides.some(g => g.steps && g.steps[0] && g.steps[0].subSteps)) { |
|
1824
|
console.log(`Database already has ${existingGuides.length} intimate detailed guides. Skipping generation.`); |
|
1825
|
return; |
|
1826
|
} |
|
1827
|
|
|
1828
|
console.log(`Seeding 180+ comprehensive multi-brand repair guides with start-to-finish intimate details...`); |
|
1829
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const allGuides = generateAllComprehensiveGuides(); |
|
1830
|
let totalSeeded = 0; |
|
1831
|
|
|
1832
|
for (const guide of allGuides) { |
|
1833
|
try { |
|
1834
|
await storage.createRepairGuide(guide); |
|
1835
|
totalSeeded++; |
|
1836
|
} catch (e) { |
|
1837
|
// ignore individual conflicts |
|
1838
|
} |
|
1839
|
} |
|
1840
|
|
|
1841
|
console.log(`Successfully generated and seeded ${totalSeeded} intimate start-to-finish technical guides!`); |
|
1842
|
} |